NXP Semiconductors

SPC5643LFF2MLL6 - 32-bit Dual-Core 64MHz MCU, 1MB Flash | NXP

Артикул: SPC5643LFF2MLL6 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
3.3 V / 5 V Vdss 100-LQFP (14 x 14 mm) Package 64 MHz Speed 1 MB (1M x 8) Memory
От $8.6 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-18
Оптовые цены
Кол-во Цена за ед. Итого
1 $12.5 $12,50
10 $11.4 $114,00
100 $10.2 $1.020,00
500 $9.3 $4.650,00
1.000 $8.6 $8.600,00
ℹ️ Все цены указаны в USD

SPC5643LFF2MLL6 Обзор

The NXP SPC5643LFF2MLL6 is a 32-bit automotive microcontroller built on Power Architecture technology (e200z4 dual-core, 64 MHz) with 1 MB of flash memory and a functional-safety-oriented Dual Power Architecture, housed in a 100-pin LQFP (14 x 14 mm) package rated from -40 C to +125 C.

An automotive microcontroller is the central embedded processor of a vehicle electronic control unit, integrating CPU cores, flash and SRAM memory, communication peripherals, and safety mechanisms on a single die. Within the hierarchy of embedded processors, the MCU sits below application processors but above bare logic, and within NXP's portfolio the SPC5643L belongs to the MPC56xx / Qorivva family of Power Architecture MCUs targeted at body, gateway, and safety applications.

Key features include a dual e200z4 32-bit core subsystem running at 64 MHz, 1 MB (1M x 8) of on-chip flash for code and calibration data, and integrated connectivity covering CANbus, FlexRay, LINbus, SPI, and UART/USART. Peripheral support for DMA, PWM, watchdog timer (WDT), and power-on reset (POR) reduces external component count.

The Dual Power Architecture places key functional safety features - such as redundant power domains and safety-oriented peripherals - on one chip, reducing design complexity for safety-relevant ECUs. The e200z4 core implements the Power Architecture (Book E) instruction set, giving access to a mature toolchain including NXP's SPC5 Studio and third-party compilers.

Typical applications include automotive body control modules, gateway nodes bridging CAN, LIN, and FlexRay networks, and industrial control systems that demand -40 C to +125 C operation and automotive-grade qualification. The QFP-100 footprint suits cost-sensitive two-layer routing of high-pin-count MCUs.

When designing with this MCU, budget flash allocation carefully: the full 1 MB is shared by application code, boot code, and calibration data, and FlexRay use requires dedicated RAM and scheduling headroom.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Аналоги без доработки для SPC5643LFF2MLL6 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с SPC5643LFF2MLL6 (тот же форм-фактор и посадочное место) — отличается по Connectivity, Package, Operating Temperature, Supply Voltage, Core Architecture.

NXP Semiconductors
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Package: 144-LQFP (20 x 20 mm, 1.40 mm height)
Operating Temperature: -40C to +125C (AEC-Q100 Grade 3)
Сравнить с SPC5643LFF2MLL6 →
NXP Semiconductors
Connectivity: 2x CAN 2.0B, 2x FlexRay, SPI, SCI, I2C
Operating Temperature: -40 C to +125 C (automotive grade)
Supply Voltage: 1.8 V / 2.5 V / 3.3 V / 5 V (mixed I/O)
Сравнить с SPC5643LFF2MLL6 →
NXP Semiconductors
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Package: 100-LQFP (14x14 mm)
Сравнить с SPC5643LFF2MLL6 →
NXP Semiconductors
Package: 176-LQFP (24 x 24 mm)
Core Architecture: Power Architecture e200z0h
Сравнить с SPC5643LFF2MLL6 →
STMicroelectronics
Core Architecture: 32-bit Power Architecture (SPC56 automotive family)
Сравнить с SPC5643LFF2MLL6 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

SPC5643LFF2MLQ1

✅ Прямая замена
STMicroelectronics
📦 100-LQFP (14 x 14 mm)
32-bit Power Architecture (SPC56 automotive family) · STMicroelectronics · SPC56 automotive MCU family

✓ В наличии

Уточнить цену

Открыть даташит →

SPC5606BF1VLU6R

✅ Прямая замена
NXP Semiconductors
📦 100-LQFP (14 x 14 mm)
Power Architecture e200z0h · 32-bit · 64 MHz · 1 MB (1M x 8) Flash · 80 KB SRAM · -40 °C to +105 °C · 176-LQFP (24 x 24 mm)

✓ В наличии

$11.1 / шт.

Открыть даташит →

SPC5602BF2MLL6

✅ Прямая замена
NXP Semiconductors
📦 100-LQFP (14 x 14 mm)
e200z0h (Power Architecture) · 32-Bit · 64 MHz · 256KB (256K x 8) · FLASH · CANbus, I2C, LINbus, SCI, SPI · DMA, POR, PWM, WDT · 79

✓ В наличии

$5.59 / шт.

Открыть даташит →

SPC5516GBMLQ66

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 100-LQFP (14 x 14 mm)
e200z0, e200z1 · 32-Bit Dual-Core · Power Architecture (MPC55xx Qorivva) · 66 MHz · 1 MB (1M x 8) FLASH · Flash with ECC · 4.5 V to 5.25 V

✓ В наличии

$10.4 / шт.

Открыть даташит →

SPC5553MVR132

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 LQFP (e200z3 family)
NXP Semiconductors (formerly Freescale) · MPC55xx Qorivva · e200z6 Power Architecture, 32-bit, single-issue · 132 MHz · 1.5 MB (1.5M x 8) · 64 KB (64K x 8) · 220 · 416-BBGA (27 mm x 27 mm)

✓ В наличии

$61.25 / шт.

Открыть даташит →

SPC5643LFF2MLL6 Максимальные параметры и электрические характеристики

Core Processor e200z4 (Power Architecture)
Core Size 32-Bit Dual-Core
Max Clock Speed 64 MHz
Flash Memory 1 MB (1M x 8)
Напряжение питания 3.3 V / 5 V
Connectivity CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT
Architecture Dual Power Architecture (functional safety features on-chip)
Series MPC56xx Qorivva
Рабочая температура -40C to +125C
Корпус 100-LQFP (14 x 14 mm)
Тип монтажа Surface Mount
Grade Automotive
Part Status Active

Руководство по цоколевке SPC5643LFF2MLL6 в корпусе 100-lqfp (14 x 14 mm)

Цоколевка для SPC5643LFF2MLL6 (корпус 100-lqfp (14 x 14 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 100-lqfp (14 x 14 mm) для SPC5643LFF2MLL6

Нет подробных данных о распиновке для SPC5643LFF2MLL6.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

SPC5643LFF2MLL6 подходит для 6 применениеs: Automotive Body Control Module, Automotive Gateway ECU, Industrial Control Systems, Chassis and Safety-Oriented Control Units, Telematics and Fleet Communication Nodes, Powertrain Auxiliary Control Units.

🚗

Automotive Body Control Module

The SPC5643LFF2MLL6 fits body control modules (BCM) because it combines dual e200z4 cores at 64 MHz with CAN and LIN controllers on a single die, allowing one processor to run the main body application and the diagnostics stack concurrently. The 1 MB flash accommodates full BCM firmware plus calibration tables, while the -40 C to +125 C automotive-grade rating survives cabin and engine-bay-adjacent environments. Its Dual Power Architecture supports safety-relevant load-disconnect and lighting functions with fewer external monitoring components. Typical designs run the LIN network for door and seat nodes off one LIN channel and the vehicle CAN backbone off another, with the 100-LQFP 14 x 14 mm footprint fitting cost-sensitive BCM PCBs. Peripheral PWM outputs directly drive lamp loads and motor H-bridges through external drivers, and the watchdog plus POR peripherals satisfy basic failure-detection requirements.

🌐

Automotive Gateway ECU

Gateway ECUs that bridge CAN, LIN, and FlexRay domains are a natural fit for the SPC5643LFF2MLL6, since it is one of the few 100-LQFP MCUs integrating all three network controllers on-chip. The dual e200z4 cores at 64 MHz partition routing/protocol handling from application logic, and DMA offloads message-buffer transfers to keep latency predictable. The 1 MB flash holds routing tables, multiple protocol stacks, and OTA-ready bootloaders with room to spare. With 3.3 V and 5 V supply domains, it interfaces directly to both legacy 5 V transceivers and modern 3.3 V PHYs without level shifting on many pins. Designers should reserve SRAM headroom for FlexRay message buffers and use the WDT plus the Dual Power Architecture monitors to meet gateway availability targets in the -40 C to +125 C automotive temperature range.

🏭

Industrial Control Systems

In industrial control, the SPC5643LFF2MLL6 offers an automotive-hardened 32-bit Power Architecture option for PLC I/O modules, motor-control heads, and rugged field controllers. Its -40 C to +125 C rating exceeds typical industrial requirements, providing margin in sealed enclosures, and the dual-core e200z4 at 64 MHz runs control loops alongside communication stacks. CANbus and UART/USART interfaces connect to drives and sensors, while PWM outputs and DMA support deterministic actuator control. The 5 V supply domain simplifies interfacing with legacy industrial 5 V logic and analog front ends, and the 1 MB flash supports protocol converters and parameter stores. The 100-LQFP 14 x 14 mm package hand-solders and reflows reliably on standard industrial PCB processes, and the WDT plus POR peripherals provide the watchdog and brownout behavior expected in continuously operating factory equipment.

🔧

Chassis and Safety-Oriented Control Units

For chassis functions such as suspension, steering-assist support nodes, and brake-related supervisory units, the SPC5643LFF2MLL6's Dual Power Architecture is the decisive feature: key functional safety mechanisms are integrated on a single chip, reducing the external safety circuit count and simplifying safety analyses. The dual e200z4 cores at 64 MHz can implement a processing path plus checking logic, and the FlexRay controller supports deterministic, fault-tolerant chassis network timing that plain CAN cannot guarantee. The 1 MB flash hosts the control algorithm plus diagnostic and end-of-line calibration code, while the -40 C to +125 C automotive grade covers wheel-arch and underhood mounting positions. Designers should follow NXP's MPC5643L safety documentation when architecting redundant sensing inputs and use the PWM and WDT peripherals for actuator supervision.

📡

Telematics and Fleet Communication Nodes

Telematics boxes and fleet-management controllers benefit from the SPC5643LFF2MLL6's breadth of communication interfaces: CAN and LIN connect to the vehicle bus for data acquisition, while UART/USART links to cellular modems and GNSS receivers. The dual e200z4 cores at 64 MHz separate protocol preprocessing from application logic, and DMA-driven UART transfers keep modem streaming efficient. The 3.3 V supply matches modern modem module I/O directly, reducing level-shifting circuitry on the telematics PCB. The 1 MB flash stores agent firmware, buffering strategies, and device certificates, and the 100-LQFP 14 x 14 mm package keeps board area compact for DIN-rail or behind-dash installations. Operating across -40 C to +125 C, the MCU tolerates both cold-soak vehicle starts and solar-loaded enclosures without derating its 64 MHz clock.

⚡

Powertrain Auxiliary Control Units

Auxiliary powertrain ECUs - fuel-pump controllers, cooling-fan modules, and thermal-management units - are well served by the SPC5643LFF2MLL6. The -40 C to +125 C automotive grade covers engine-compartment mounting, and the 5 V supply domain interfaces with ratiometric sensors and legacy powertrain transceivers. Dual e200z4 cores at 64 MHz execute the control algorithm on one core while running diagnostics and CAN/LIN reporting on the other, and PWM peripherals drive MOSFET pre-drivers for pump and fan motors. The Dual Power Architecture supports the fail-safe behaviors these modules require, such as controlled shutdown on fault detection, with fewer external supervisory ICs. The 1 MB flash is ample for adaptive control strategies plus end-of-line calibration tables, and the 100-LQFP footprint suits the compact, thermally dissipative layouts typical of auxiliary powertrain boards.

What is the SPC5643LFF2MLL6 microcontroller?
The SPC5643LFF2MLL6 is an NXP 32-bit automotive microcontroller from the MPC56xx Qorivva family. It is built on Power Architecture technology with a dual-core e200z4 CPU running at 64 MHz, integrates 1 MB of flash memory, and provides CANbus, FlexRay, LINbus, SPI, and UART/USART connectivity in a 100-pin LQFP (14 x 14 mm) package rated from -40 C to +125 C for automotive-grade applications.
What is the price of SPC5643LFF2MLL6?
As of 2026-10-18, the SPC5643LFF2MLL6 is listed at approximately $12.50 for quantity 1, tapering to about $8.60 at 1000 units on XAIPART. Distributor pricing on Mouser, DigiKey, and Octopart aggregates offers from 4 distributors, so bulk pricing varies by channel and stock position. Always request a formal quote for volume orders, as automotive MCUs can show significant lead-time-driven price movement between quarters.
Where to buy SPC5643LFF2MLL6 online?
You can buy the SPC5643LFF2MLL6 on XAIPART, and it is also listed at authorized distributors including Mouser, DigiKey, and via Octopart, which compares bulk discounts from 4 distributors. Because this is an automotive-grade NXP part, purchasing through authorized channels is strongly recommended to avoid counterfeit risk; Rochester Electronics also lists the part as an authorized aftermarket source for NXP MPC56xx devices.
Is SPC5643LFF2MLL6 in stock and what is the lead time?
Stock status changes frequently for automotive MCUs; DigiKey listed the SPC5643LFF2MLL6 as orderable and shipping at the time of verification. On XAIPART, availability and lead time are confirmed at quote time since this part is handled on a request basis. For production programs, we recommend securing buffer stock or a scheduled-order agreement, because MPC56xx Qorivva devices have historically shown multi-week lead times during allocation periods.
What is the best drop-in replacement for SPC5643LFF2MLL6?
The best drop-in replacement is the SPC5643LFF2MLQ1, which shares the same die, the same 100-LQFP (14 x 14 mm) footprint, and the same 1 MB flash / 64 MHz / dual e200z4 core configuration, differing only in automotive qualification grade designation. The SPC5606BF1VLU6R is another same-package 100-LQFP candidate but requires verification of pinout and flash mapping before adoption. Always confirm pin-to-pin compatibility against the NXP datasheet before committing a redesign.
SPC5643LFF2MLL6 vs STM32L476VGT6 - which is better for automotive use?
For automotive functional-safety applications, the SPC5643LFF2MLL6 is the stronger choice. According to NXP product data, it integrates a Dual Power Architecture with on-chip safety features, FlexRay, and a -40 C to +125 C automotive-grade rating. The STM32L476VGT6 is a low-power Cortex-M4 MCU optimized for battery applications, lacking FlexRay and the safety-oriented power architecture, and it is not positioned as an automotive-grade Qorivva-class device.
What is the difference between SPC5643LFF2MLL6 and SPC5643LFF2MLQ1?
The SPC5643LFF2MLL6 and SPC5643LFF2MLQ1 are the same silicon in the same 100-LQFP package with identical 1 MB flash, 64 MHz dual e200z4 cores, and the same peripheral set including CAN, FlexRay, and LIN. The suffix difference relates to ordering/qualification variant designation; both are automotive-targeted parts. Per ETEI's comparison, the two parts differ in qualification/mounting documentation rather than electrical functionality, making the MLQ1 a near-identical same-footprint option.
Is SPC5643LFF2MLL6 suitable for body control modules and gateways?
Yes. The SPC5643LFF2MLL6 is specifically suited to body control modules and network gateway ECUs because it integrates CAN, FlexRay, and LIN controllers - the three dominant automotive bus types - alongside 1 MB of flash and dual e200z4 cores at 64 MHz for concurrent application and diagnostics processing. The on-chip Dual Power Architecture reduces external safety circuitry, and the -40 C to +125 C operating range covers underhood and body-zone environments.
When should I choose SPC5643LFF2MLL6 over SPC560B60L3C6E0Y?
Choose the SPC5643LFF2MLL6 when your application requires FlexRay connectivity or the Dual Power Architecture functional-safety features, since both parts are IC MCU 32BIT 1MB FLASH in 100-LQFP packages. The SPC560B60L3C6E0Y is a lower-cost SPC560B-line device suited to simpler body and chassis nodes without FlexRay. If your network design is CAN/LIN only and cost is dominant, the SPC560B family may suffice; if FlexRay or safety architecture is mandated, the MPC5643L is the appropriate family.
Where to download the SPC5643LFF2MLL6 datasheet PDF?
Download the SPC5643LFF2MLL6 datasheet PDF from the official NXP product page at nxp.com/part/SPC5643LFF2MLL6, which hosts the current MPC5643L Microcontroller Data Sheet (136 pages per aggregator listings). Mirror copies exist on alldatasheet.com and datasheets.com, but NXP's own site guarantees the latest revision, including errata and product change notices that are essential for automotive design freeze.
Where can I find the SPC5643LFF2MLL6 pinout for the 100-LQFP package?
The complete 100-pin LQFP pinout for the SPC5643LFF2MLL6 is documented in the MPC5643L Microcontroller Data Sheet available from NXP's product page. The 14 x 14 mm LQFP arranges 100 pins in 25 per side, multiplexing GPIO with CAN, FlexRay, LIN, SPI, and UART functions. Because pin multiplexing depends on the pad configuration register settings, always consult the signal description tables in the datasheet rather than third-party pinout summaries when assigning pins.
What are the key specifications of SPC5643LFF2MLL6 that engineers should know?
Key facts: 32-bit dual-core e200z4 Power Architecture CPU at 64 MHz; 1 MB (1M x 8) on-chip flash; supply of 3.3 V and 5 V domains; connectivity spanning CANbus, FlexRay, LINbus, SPI, and UART/USART; peripherals including DMA, POR, PWM, and WDT; 100-LQFP 14 x 14 mm surface-mount package; -40 C to +125 C automotive-grade temperature range; part status Active per NXP. Source: NXP product data and DigiKey listing.
What can replace SPC5643LFF2MLL6 if it becomes unavailable?
The nearest same-footprint replacements are the NXP SPC5643LFF2MLQ1 (same die and 100-LQFP package) and the SPC5606BF1VLU6R (same package and 1 MB flash class, family-level differences to verify). Outside the SPC56xx family, no true pin-to-pin drop-in exists, since Power Architecture pad functions are proprietary; a redesign would be needed for non-NXP parts such as the STM32L476VGT6, which shares neither footprint nor instruction set. For lifecycle-long supply, Rochester Electronics offers authorized aftermarket sourcing of this exact MPN.
Is SPC5643LFF2MLL6 RoHS compliant and lead-free?
The SPC5643LFF2MLL6 is an active, automotive-grade NXP part currently in production, and NXP's standard production policy for SPC56xx devices is RoHS-compliant, lead-free assembly. However, the specific RoHS, REACH, and halogen-free declarations for this exact ordering code were not captured in the verified data for this page, so we mark compliance as requiring confirmation. Download the official certificate of conformance from nxp.com/part/SPC5643LFF2MLL6 before finalizing compliance documentation.
What is the NXP equivalent for SPC5643LFF2MLL6 outside the SPC56xx family?
Within NXP, the closest family equivalents are SPC5643L variants such as the MLQ1 ordering code (same die, same package) and the wider MPC56xx Qorivva line. There is no cross-brand pin-to-pin NXP equivalent: the 100-LQFP pad map and Dual Power Architecture are unique to the MPC5643L family. Engineers migrating to other vendors - for example ST's STM32L476VGT6 - must plan a full hardware and software redesign, including toolchain migration away from the Power Architecture e200z4 core.

Справочные инженерные данные для SPC5643LFF2MLL6 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the SPC5643LFF2MLL6 when your ECU needs FlexRay, the Dual Power Architecture safety features, or a dual-core e200z4 at 64 MHz with 1 MB flash in a 100-LQFP automotive package - typical cases are gateways, chassis supervisory nodes, and BCMs with safety-relevant functions. Choose the SPC5643LFF2MLQ1 if its qualification designation matches your program documentation; it is the same die and footprint. Choose the SPC5606BF1VLU6R when the network is CAN/LIN only and cost matters more than FlexRay, accepting that pinout verification is mandatory before swap. Choose the SPC5602BF2MLL6 for cost-driven body nodes with reduced memory needs. Avoid non-NXP substitutes such as the STM32L476VGT6 unless you accept a full hardware and software redesign: the Power Architecture instruction set, pad multiplexing, and safety architecture are not portable.

Сравнение с аналогами

Параметр Этот товар SPC5643LFF2MLQ1 SPC5606BF1VLU6R SPC5602BF2MLL6 SPC5516GBMLQ66
Package 100-LQFP (14 x 14 mm) 100-LQFP (14 x 14 mm) - same 100-LQFP - same class 100-LQFP (MLL6) - same 100-LQFP - same class
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core / Clock e200z4 dual-core, 64 MHz e200z4 dual-core, 64 MHz e200z3-family SPC560B core SPC560B core e200z0/z1-class, 66 MHz

Ключевые отличия

  • On-chip FlexRay controller (против SPC5606BF1VLU6R)
  • Dual Power Architecture functional-safety integration (против SPC5602BF2MLL6)
  • Dual-core e200z4 at 64 MHz with 1 MB flash (против SPC5516GBMLQ66)

Заметки по проектированию

The SPC5643LFF2MLL6 uses 3.3 V and 5 V supply domains. Verify the internal regulator (if used) versus external regulator supply scheme early, per the MPC5643L power architecture section of the NXP datasheet, because the Dual Power Architecture assigns safety monitors to specific domains. Decouple each supply pin pair with 100 nF ceramics placed within 2 mm of the pin, plus bulk 10 uF per domain. Ensure the 5 V rail powers the flash/VDD domain per datasheet recommendations before code execution begins.

The 100-LQFP (14 x 14 mm) package has 0.5 mm pitch leads - use NSMD pads and solder-mask-defined avoidance of bridging on the CAN/FlexRay transceiver trace exits. Route FlexRay differential pairs as 100-ohm controlled impedance and keep them away from the crystal and switching regulator. Place the 8-40 MHz reference crystal (per NXP clocking options) close to the EXTAL/XTAL pins with ground guard. Allocate one full ground plane; do not split it under the MCU.

Three frequent mistakes with MPC5643L designs: (1) assuming all 100 pins are GPIO - many pads are multiplexed and some functions are mutually exclusive, so confirm with the signal-multiplexing tables in the NXP datasheet; (2) omitting the boot configuration strapping, which leaves the device booting from the wrong memory window; (3) under-budgeting SRAM for FlexRay message buffers, causing runtime allocation failure. Also verify the -40 C to +125 C rating of every companion part, not just the MCU.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

Verified data confirms automotive-grade classification and active status but did not include explicit RoHS/REACH/halogen declarations for this ordering code. Obtain the certificate of conformance from nxp.com/part/SPC5643LFF2MLL6.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors SPC5643LFF2MLL6 MPC5643L MPC56xx Qorivva SPC5643LFF2MLQ1 SPC5606BF1VLU6R STM32L476VGT6 Power Architecture e200z4 microcontroller 32-bit MCU FlexRay CANbus LINbus 100-LQFP LQFP package family surface mount AEC-Q100 automotive grade RoHS REACH body control module gateway ECU dual-core processor functional safety DMA PWM
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