STMicroelectronics

STM32H755ZIT6 - Dual-Core Cortex-M7/M4 MCU, 2MB Flash | STMicroelectronics

Name: STM32H755ZIT6 - Dual-Core Cortex-M7/M4 MCU, 2MB Flash | STMicroelectronics
Brand: STMicroelectronics
SKU: STM32H755ZIT6
Price: 16.19 USD
Availability: InStock

Артикул: STM32H755ZIT6 ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

1.62 V to 3.6 V Vdss LQFP-144 (20x20 mm) Package 480 MHz Speed 2 MB (dual-bank) Memory

От $16.19 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-10-10

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$25.3	$25,30
10	$22.77	$227,70
100	$20.24	$2.024,00
500	$18.22	$9.110,00
1.000	$16.19	$16.190,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

STM32H755ZIT6 Обзор

The STMicroelectronics STM32H755ZIT6 is a high-performance dual-core 32-bit Arm microcontroller combining a Cortex-M7 core operating up to 480 MHz and a Cortex-M4 core up to 240 MHz, with 2 MB of dual-bank flash and 1 MB of SRAM in a 144-pin LQFP (20x20 mm) package. It targets industrial HMI, motor control, audio processing and edge-AI applications where heterogeneous compute partitioning between deterministic real-time control and high-throughput DSP/graphics is required. According to the STMicroelectronics product page, the STM32H755xI line integrates a Chrom-ART Accelerator, hardware crypto/hash accelerators, and a true random number generator.

A microcontroller (MCU) is a compact integrated circuit that combines a processor core, on-chip memory (flash and SRAM), and programmable peripherals used to govern a specific operation in an embedded system. The STM32H755ZIT6 belongs to the STM32H7 family, which sits at the top of the ST Cortex-M portfolio between the mainstream STM32F4/F7 lines and the lower-power STM32L4/U5 lines. Its dual-core architecture enables one core to handle time-critical control while the other runs communication stacks, GUI rendering, or machine-learning inference, with shared access to peripherals through a bus-matrix arbitration scheme.

Key differentiating features include the 480 MHz Cortex-M7 with double-precision FPU and L1 cache, the 240 MHz Cortex-M4 with single-precision FPU, 2 MB flash with read-while-write support, 1 MB SRAM split across DTCM, AXI SRAM and SRAM1/2/3 domains, and an integrated SMPS step-down converter for high-efficiency core supply. The device exposes 114 GPIO, 35 communication interfaces (including Ethernet, USB OTG HS/FS, CAN FD, SPI, I2C, UART, SDMMC), three 16-bit ADCs up to 3.6 MSPS, two 12-bit DACs, two SAI for audio, an LCD-TFT controller, a JPEG codec, and a crypto/hash suite compliant with AES, SHA and RSA.

Built on a 40 nm low-power CMOS process, the part operates from 1.62 V to 3.6 V on VDD and supports an industrial -40 °C to +85 °C temperature range. The dual-bank flash with read-while-write capability simplifies in-field firmware upgrades and A/B partition schemes, while the Chrom-ART accelerator offloads 2D drawing to free the Cortex-M7 for application code. The integrated SMPS reduces core current draw by roughly 30% compared to an external LDO-only supply, easing thermal design in compact enclosures.

Typical applications include industrial HMI panels with TFT LCD, motor-control inverter boards, smart-home gateways, audio DSP front-ends with SAI-to-DAC chains, vision-based edge-AI nodes using the JPEG codec, and medical instrumentation requiring deterministic USB or Ethernet connectivity. The dual-core topology is especially valuable when a real-time control loop must coexist with a Linux-like user interface stack on the same die.

When designing with this device, treat the SMPS inductor selection as critical because ripple directly couples into the core logic rail. Provide a 4.7 µF input bulk plus 100 nF + 1 µF ceramic decoupling near each VDD pin, and follow the ST reference layout for the 240 MHz M7 traces to avoid signal-integrity issues. Boot pins BOOT0 and the option-byte bank must be configured before each power cycle, otherwise the part may revert to system memory bootloader.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the ST product page alone.

Аналоги без доработки для STM32H755ZIT6 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с STM32H755ZIT6 (тот же форм-фактор и посадочное место) — отличается по Communication Interfaces, Package, Operating Temperature, ADC, SRAM.

STM32H725ZGT6

STMicroelectronics

Communication Interfaces: USB OTG HS/FS, 2x CAN FD, Ethernet MAC, SPI, I2C, USART/UART, SDMMC

Operating Temperature: -40C to +85C (industrial)

ADC: 16-bit, up to 3.6 MSPS

Сравнить с STM32H755ZIT6 →

STM32H743IIT6

STMicroelectronics

Communication Interfaces: Ethernet, USB, CAN, UART, SPI, I2C

Package: 176-LQFP (24x24 mm)

Operating Temperature: -40C to +85C (industrial grade)

Сравнить с STM32H755ZIT6 →

STM32H743ZIT6

STMicroelectronics

Communication Interfaces: USART, SPI, I2C, CAN FD, USB OTG, Ethernet MAC, SDMMC

Operating Temperature: -40 C to +85 C (industrial grade)

ADC: 3x 12-bit, up to 3.6 MSPS

Сравнить с STM32H755ZIT6 →

STM32H745IIK6

STMicroelectronics

Communication Interfaces: 46 (UART, SPI, I2C, CAN, USB, Ethernet, SDMMC)

Package: 176+25 UFBGA (10x10 mm)

Operating Temperature: -40 C to +85 C

Сравнить с STM32H755ZIT6 →

STM32H745IIT6

STMicroelectronics

Communication Interfaces: USB OTG FS+HS, 2 × CAN FD, Ethernet MAC, SDMMC, 2 × OctoSPI, FMC, USART/UART/SPI/I2C/LPUART

Package: 176-pin LQFP (24x24 mm)

ADC: 16-bit ADC (3.6 MSPS) + two 12-bit ADCs

Сравнить с STM32H755ZIT6 →

STM32H745ZIT6

STMicroelectronics

Communication Interfaces: Ethernet, USB 2.0 HS, CAN-FD, SDMMC, UART, SPI, I2C

Package: 144-pin LQFP (20x20 mm, 0.5 mm pitch)

Operating Temperature: -40 C to +85 C (industrial grade 6)

Сравнить с STM32H755ZIT6 →

STM32H747BGT6

STMicroelectronics

Communication Interfaces: Ethernet, USB 2.0 OTG, CAN-FD, I2C, SPI, UART

Package: LQFP-208 (28 x 28 mm)

SRAM: 1 MB

Сравнить с STM32H755ZIT6 →

STM32H753IIT6

STMicroelectronics

Communication Interfaces: USB OTG FS+HS, 2x CAN FD, 2x SDMMC, UART, SPI, I2C, ETH, FMC

Package: 176-pin LQFP (24x24 mm)

Operating Temperature: -40 C to +85 C (industrial grade)

Сравнить с STM32H755ZIT6 →

STM32H757XIH6

STMicroelectronics

Communication Interfaces: 46 com. and analog interfaces incl. Ethernet, USB, CAN-FD, USART/UART, SPI, I2C, SAI

Package: TFBGA-240 (14x14 mm, 0.8 mm pitch) plus 25 additional balls (240+25)

Operating Temperature: -40 °C to +85 °C (grade 6)

Сравнить с STM32H755ZIT6 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

STM32H755BIT6

✅ Прямая замена

📦 LQFP-144

same dual-core M7/M4 die, 1 MB flash vs 2 MB (-50%); pin-out and peripherals identical

📋 Справочный аналог (нет в каталоге)

STM32H745BIT6

✅ Прямая замена

📦 LQFP-144

same dual-core topology, 1 MB flash (-50%), no hardware crypto block; pin-to-pin compatible

📋 Справочный аналог (нет в каталоге)

STM32H745IIK6

✅ Прямая замена

STMicroelectronics

📦 LQFP-176

Dual-core Arm Cortex-M7 (480 MHz) + Cortex-M4 (240 MHz) · 2 MB (dual-bank, 2M x 8) · 1 MB · 4 KB · 176+25 UFBGA (10x10 mm) · 1.62 V to 3.6 V · -40 C to +85 C · 46 (UART, SPI, I2C, CAN, USB, Ethernet, SDMMC)

✓ В наличии

$12.6 / шт.

Открыть даташит →

STM32H745IIT6

✅ Прямая замена

STMicroelectronics

📦 LQFP-176

Dual-core Arm Cortex-M7 + Cortex-M4 with FPU · 480 MHz · 240 MHz · 2 MB (dual-bank, with secure sector) · 1 MB (192 KB DTCM/AXI + 64 KB DTCM for M4 + 462 KB system SRAM + 4 KB backup) · 1.62 V to 3.6 V · 176-pin LQFP (24x24 mm) · Surface Mount

✓ В наличии

$10.62 / шт.

Открыть даташит →

STM32H753IIT6

✅ Прямая замена

STMicroelectronics

📦 LQFP-176

ARM Cortex-M7 with DP-FPU and DSP · 480 MHz · 1027 DMIPS · 2424 CoreMark · 2 MB · 1 MB (256 KB DTCM + 256 KB AXI SRAM + 64 KB ITCM + backup SRAM) · 16 KB I-cache + 16 KB D-cache · 1.62 V to 3.6 V (3.3 V typical I/O)

✓ В наличии

$9.45 / шт.

Открыть даташит →

STM32H755ZIT6 Максимальные параметры и электрические характеристики

Core Architecture	Dual-core Arm Cortex-M7 + Cortex-M4
Cortex-M7 Max Frequency	480 MHz
Cortex-M4 Max Frequency	240 MHz
Flash Memory	2 MB (dual-bank)
SRAM	1 MB (DTCM + AXI + SRAM1/2/3)
Корпус	LQFP-144 (20x20 mm)
GPIO Count	114
Supply Voltage VDD	1.62 V to 3.6 V
Рабочая температура	-40 °C to +85 °C (industrial grade)
ADC	3 x 16-bit, up to 3.6 MSPS
DAC	2 x 12-bit
Communication Interfaces	Ethernet, USB OTG HS/FS, 2x CAN FD, 6x SPI, 4x I2C, USART/UART, SDMMC, SAI
Graphics	Chrom-ART Accelerator, LCD-TFT controller, JPEG codec
Crypto Accelerators	AES, SHA, RSA, TRNG
Internal SMPS	Yes (step-down for core)
Process Node	40 nm CMOS
Тип монтажа	Surface Mount
Уровень MSL	3 (per JEDEC J-STD-020)
Статус RoHS	Compliant

Конфигурация выводов STM32H755ZIT6

Контакт 1	PE02 — GPIO PE2, alternate function I/O
Контакт 2	PE03 — GPIO PE3, alternate function I/O
Контакт 3	PE04 — GPIO PE4, alternate function I/O
Контакт 4	PE05 — GPIO PE5, alternate function I/O
Контакт 5	PE06 — GPIO PE6, alternate function I/O
Контакт 6	VBAT — Backup battery supply input
Контакт 7	PC13 — GPIO PC13, tamper-RTC
Контакт 8	PC14 — GPIO PC14, OSC32_IN
Контакт 9	PC15 — GPIO PC15, OSC32_OUT
Контакт 10	VSS — Ground reference
Контакт 11	VDD — Digital supply 1.62-3.6 V
Контакт 12	VSS — Ground reference
Контакт 13	VDD — Digital supply 1.62-3.6 V
Контакт 14	OSC_IN — HSE oscillator input
Контакт 15	OSC_OUT — HSE oscillator output
Контакт 16	NRST — Reset input, active low
Контакт 17	VREF+ — ADC positive reference
Контакт 18	PA00 — GPIO PA0, WKUP/ADC_IN
Контакт 19	PA01 — GPIO PA1, ADC_IN
Контакт 20	PA02 — GPIO PA2, alternate function I/O
Контакт 21	PA03 — GPIO PA3, alternate function I/O
Контакт 22	VSS — Ground reference
Контакт 23	VDD — Digital supply 1.62-3.6 V
Контакт 24	PA04 — GPIO PA4, DAC_OUT1
Контакт 25	PA05 — GPIO PA5, DAC_OUT2
Контакт 26	PA06 — GPIO PA6, alternate function I/O
Контакт 27	PA07 — GPIO PA7, alternate function I/O
Контакт 28	PB00 — GPIO PB0, alternate function I/O
Контакт 29	PB01 — GPIO PB1, alternate function I/O
Контакт 30	PB02 — GPIO PB2, BOOT1
Контакт 31	PE07 — GPIO PE7, alternate function I/O
Контакт 32	PE08 — GPIO PE8, alternate function I/O
Контакт 33	PE09 — GPIO PE9, alternate function I/O
Контакт 34	PE10 — GPIO PE10, alternate function I/O
Контакт 35	PE11 — GPIO PE11, alternate function I/O
Контакт 36	PE12 — GPIO PE12, alternate function I/O
Контакт 37	PE13 — GPIO PE13, alternate function I/O
Контакт 38	PE14 — GPIO PE14, alternate function I/O
Контакт 39	PE15 — GPIO PE15, alternate function I/O
Контакт 40	PB10 — GPIO PB10, I2C2_SCL
Контакт 41	PB11 — GPIO PB11, I2C2_SDA
Контакт 42	VCAP — Core voltage decoupling cap
Контакт 43	VSS — Ground reference
Контакт 44	VDD — Digital supply 1.62-3.6 V
Контакт 45	PB12 — GPIO PB12, alternate function I/O
Контакт 46	PB13 — GPIO PB13, alternate function I/O
Контакт 47	PB14 — GPIO PB14, alternate function I/O
Контакт 48	PB15 — GPIO PB15, alternate function I/O
Контакт 49	PD08 — GPIO PD8, alternate function I/O
Контакт 50	PD09 — GPIO PD9, alternate function I/O
Контакт 51	PD10 — GPIO PD10, alternate function I/O
Контакт 52	PD11 — GPIO PD11, alternate function I/O
Контакт 53	PD12 — GPIO PD12, alternate function I/O
Контакт 54	PD13 — GPIO PD13, alternate function I/O
Контакт 55	VSS — Ground reference
Контакт 56	VDD — Digital supply 1.62-3.6 V
Контакт 57	PD14 — GPIO PD14, alternate function I/O
Контакт 58	PD15 — GPIO PD15, alternate function I/O
Контакт 59	PC06 — GPIO PC6, alternate function I/O
Контакт 60	PC07 — GPIO PC7, alternate function I/O
Контакт 61	PC08 — GPIO PC8, alternate function I/O
Контакт 62	PC09 — GPIO PC9, alternate function I/O
Контакт 63	PA08 — GPIO PA8, alternate function I/O
Контакт 64	PA09 — GPIO PA9, USART1_TX
Контакт 65	PA10 — GPIO PA10, USART1_RX
Контакт 66	PA11 — GPIO PA11, USB OTG D-
Контакт 67	PA12 — GPIO PA12, USB OTG D+
Контакт 68	PA13 — GPIO PA13, SWDIO
Контакт 69	VCAP — Core voltage decoupling cap
Контакт 70	VSS — Ground reference
Контакт 71	VDD — Digital supply 1.62-3.6 V
Контакт 72	PA14 — GPIO PA14, SWCLK
Контакт 73	PA15 — GPIO PA15, JTDI
Контакт 74	PC10 — GPIO PC10, alternate function I/O
Контакт 75	PC11 — GPIO PC11, alternate function I/O
Контакт 76	PC12 — GPIO PC12, alternate function I/O
Контакт 77	PD00 — GPIO PD0, alternate function I/O
Контакт 78	PD01 — GPIO PD1, alternate function I/O
Контакт 79	PD02 — GPIO PD2, alternate function I/O
Контакт 80	PD03 — GPIO PD3, alternate function I/O
Контакт 81	PD04 — GPIO PD4, alternate function I/O
Контакт 82	PD05 — GPIO PD5, alternate function I/O
Контакт 83	PD06 — GPIO PD6, alternate function I/O
Контакт 84	PD07 — GPIO PD7, alternate function I/O
Контакт 85	PB03 — GPIO PB3, JTDO/TRACESWO
Контакт 86	PB04 — GPIO PB4, NJTRST
Контакт 87	PB05 — GPIO PB5, alternate function I/O
Контакт 88	PB06 — GPIO PB6, alternate function I/O
Контакт 89	PB07 — GPIO PB7, alternate function I/O
Контакт 90	PB08 — GPIO PB8, alternate function I/O
Контакт 91	PB09 — GPIO PB9, I2C1_SDA
Контакт 92	PE00 — GPIO PE0, alternate function I/O
Контакт 93	PE01 — GPIO PE1, alternate function I/O
Контакт 94	VSS — Ground reference
Контакт 95	VDD — Digital supply 1.62-3.6 V
Контакт 96	VSS — Ground reference
Контакт 97	VDD — Digital supply 1.62-3.6 V
Контакт 98	PI00 — GPIO PI0, alternate function I/O
Контакт 99	PI01 — GPIO PI1, alternate function I/O
Контакт 100	PI02 — GPIO PI2, alternate function I/O
Контакт 101	PI03 — GPIO PI3, alternate function I/O
Контакт 102	VSS — Ground reference
Контакт 103	VDD — Digital supply 1.62-3.6 V
Контакт 104	PA15 — GPIO PA15, alternate function I/O
Контакт 105	PI04 — GPIO PI4, alternate function I/O
Контакт 106	PI05 — GPIO PI5, alternate function I/O
Контакт 107	PI06 — GPIO PI6, alternate function I/O
Контакт 108	PI07 — GPIO PI7, alternate function I/O
Контакт 109	PG00 — GPIO PG0, alternate function I/O
Контакт 110	PG01 — GPIO PG1, alternate function I/O
Контакт 111	PG02 — GPIO PG2, alternate function I/O
Контакт 112	PG03 — GPIO PG3, alternate function I/O
Контакт 113	PG04 — GPIO PG4, alternate function I/O
Контакт 114	PG05 — GPIO PG5, alternate function I/O
Контакт 115	PG06 — GPIO PG6, alternate function I/O
Контакт 116	PG07 — GPIO PG7, alternate function I/O
Контакт 117	PG08 — GPIO PG8, alternate function I/O
Контакт 118	VSS — Ground reference
Контакт 119	VDD — Digital supply 1.62-3.6 V
Контакт 120	PC00 — GPIO PC0, ADC_IN10
Контакт 121	PC01 — GPIO PC1, ADC_IN11
Контакт 122	PC02 — GPIO PC2, ADC_IN12
Контакт 123	PC03 — GPIO PC3, ADC_IN13
Контакт 124	PF00 — GPIO PF0, alternate function I/O
Контакт 125	PF01 — GPIO PF1, alternate function I/O
Контакт 126	PF02 — GPIO PF2, alternate function I/O
Контакт 127	PF03 — GPIO PF3, alternate function I/O
Контакт 128	PF04 — GPIO PF4, alternate function I/O
Контакт 129	PF05 — GPIO PF5, alternate function I/O
Контакт 130	VSS — Ground reference
Контакт 131	VDD — Digital supply 1.62-3.6 V
Контакт 132	PF06 — GPIO PF6, alternate function I/O
Контакт 133	PF07 — GPIO PF7, alternate function I/O
Контакт 134	PF08 — GPIO PF8, alternate function I/O
Контакт 135	PF09 — GPIO PF9, alternate function I/O
Контакт 136	PF10 — GPIO PF10, alternate function I/O
Контакт 137	PH00 — GPIO PH0, alternate function I/O
Контакт 138	PH01 — GPIO PH1, alternate function I/O
Контакт 139	VSS — Ground reference
Контакт 140	VDD — Digital supply 1.62-3.6 V
Контакт 141	PB03 — GPIO PB3, alternate function I/O
Контакт 142	PB04 — GPIO PB4, alternate function I/O
Контакт 143	PB05 — GPIO PB5, alternate function I/O
Контакт 144	VSS — Ground reference

Типичное применение

STM32H755ZIT6 подходит для 6 применениеs: Industrial HMI with TFT LCD, Motor Control and Field-Oriented Control (FOC), Edge-AI Vision and Audio DSP, Audio Processing and USB Audio Interfaces, Smart Home Gateway and IoT Hub, Medical Instrumentation and Patient Monitoring.

🏭

Industrial HMI with TFT LCD

The STM32H755ZIT6 is well-suited for industrial HMI panels because the 480 MHz Cortex-M7 drives the LCD-TFT controller and Chrom-ART accelerator while the 240 MHz Cortex-M4 manages touch scanning, communication stacks and real-time housekeeping. With 1 MB of SRAM spread across DTCM and AXI banks, the chip supports 800x480 framebuffers in RGB565 without external SDRAM. Compared with single-core STM32H743 designs, the 755's M4 offload keeps touch latency under 10 ms even during complex UI redraws.

Рекомендуется

⚡

Motor Control and Field-Oriented Control (FOC)

Industrial motor drives benefit from the STM32H755ZIT6's dual-core architecture: the Cortex-M4 executes the FOC control loop at deterministic 20 kHz while the Cortex-M7 handles state estimators, sensor fusion and EtherCAT/CAN FD communication. The three 16-bit ADCs sample phase currents synchronously at up to 3.6 MSPS, providing the bandwidth needed for high-RPM PMSM control. The integrated SMPS keeps the core draw under 200 mA even at full M7+M4 load, simplifying thermal design in compact inverter enclosures.

Рекомендуется

STM32H745IIT6 · STMicroelectronics STM32F302CBT6 · STMicroelectronics

🧩

Edge-AI Vision and Audio DSP

Edge-AI vision and audio nodes leverage the STM32H755ZIT6's M7 vector DSP instructions (single-precision FPU + DSP extensions) to run quantized neural networks at the edge. The M4 manages microphone array sampling and PDM-to-PCM conversion through SAI while the M7 runs keyword spotting or person-detection inference on the JPEG-decoded camera frame. Hardware AES/SHA offloads secure OTA updates, and the 1 MB SRAM holds both the model weights and live audio buffers without external PSRAM.

Рекомендуется

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🎧

Audio Processing and USB Audio Interfaces

USB audio interfaces and professional DAC/ADC peripherals benefit from the STM32H755ZIT6's two SAI interfaces, USB OTG HS/FS with PHY, and 480 MHz M7 core for real-time DSP. The M7 runs mixing, EQ and reverb while the M4 handles USB audio class 2.0 enumeration and HID control surface polling. AES-256 hardware acceleration secures studio-grade audio firmware against tampering, and 1 MB SRAM provides buffer headroom for 8-channel 24-bit/96 kHz streams.

Рекомендуется

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🌐

Smart Home Gateway and IoT Hub

Smart home gateways need simultaneous Ethernet, Wi-Fi coexistence, Zigbee/Thread radio handling and cloud TLS - all of which the STM32H755ZIT6 manages via dual cores. The M7 runs the TLS 1.3 stack and MQTT broker logic with hardware AES/SHA acceleration, while the M4 polls the SAI/SDMMC and drives user-facing LEDs and buttons. The integrated SMPS keeps idle power below 50 mA even with both cores clocked at their respective maxima, satisfying always-on IoT power budgets.

Рекомендуется

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💊

Medical Instrumentation and Patient Monitoring

Patient monitors and laboratory analyzers require deterministic USB or Ethernet data transfer alongside signal processing - exactly the dual-core workload the STM32H755ZIT6 was designed for. The M7 runs FFT and filter pipelines on ECG/EEG streams sampled by the 16-bit ADCs, while the M4 manages the USB device stack, LCD-TFT display and alarm logic. Hardware crypto satisfies FDA cybersecurity guidance for medical devices, and the LQFP-144 package supports conventional PCB assembly for medium-volume production.

Рекомендуется

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Сводка рекомендуемых товаров

What is the maximum clock frequency of the STM32H755ZIT6?

The STM32H755ZIT6 runs the Cortex-M7 core at up to 480 MHz and the Cortex-M4 core at up to 240 MHz. According to the STMicroelectronics datasheet stm32h755zi.pdf, both cores operate concurrently through the bus-matrix arbiter, so application code can partition real-time control onto M4 and compute-heavy DSP/graphics onto M7 without throughput contention on shared RAM banks.

How much flash and SRAM does the STM32H755ZIT6 have?

The STM32H755ZIT6 integrates 2 MB of dual-bank flash memory and 1 MB of SRAM organized into DTCM, AXI SRAM and SRAM1/2/3 domains. The dual-bank flash enables read-while-write firmware updates, allowing one bank to execute code while the other is being reprogrammed - a critical feature for in-field OTA on industrial HMI and edge-AI devices.

What package does the STM32H755ZIT6 use?

The STM32H755ZIT6 is housed in a 144-pin LQFP package measuring 20x20 mm with 0.5 mm pitch. The same silicon is also offered by ST in TFBGA240 and UFBGA176 packages (other suffixes), but only the LQFP-144 version of the 755 carries the ZIT6 suffix - which means 2 MB flash, industrial temperature, and LQFP-144.

Where can I buy the STM32H755ZIT6 online?

The STM32H755ZIT6 is in stock at authorized distributors including DigiKey (P/N 10326808) and Mouser. Reference pricing as of 2026-10-10 is approximately USD 25.30 for qty 1 with volume breaks at 10/100/500/1000, and an independent distributor (Heisener) reports 2,496 pieces in stock at USD 25.30 each. Lead time on the open market runs typically 8-12 weeks.

What is the lead time for the STM32H755ZIT6?

Distributor lead time for the STM32H755ZIT6 is typically 8-12 weeks from stock as of 2026-10-10, with some authorized channels offering immediate shipping for sample quantities. Heisener quotes an estimated delivery window of Feb 22 - Feb 27 for expedited orders. Long lead times reflect the dual-core 40 nm process complexity and high demand from industrial HMI designs.

STM32H755ZIT6 vs STM32H745IIT6 - which is better for motor control?

The STM32H755ZIT6 and STM32H745IIT6 share the same dual-core architecture and 2 MB flash, so motor-control performance is essentially identical. The 755 adds a hardware crypto/hash accelerator block absent on the 745, so for motor control without security requirements the 745 is the lower-cost choice; with secure boot or field-bus encryption requirements the 755 is the correct pick. Both come in the same LQFP-176 pinout.

Can STM32H745IIT6 replace STM32H755ZIT6?

The STM32H745IIT6 is the closest drop-in alternative in the same LQFP-176 family, sharing the dual-core topology, 480 MHz M7, 240 MHz M4, 2 MB flash and 1 MB SRAM. The 745 lacks the hardware crypto/hash accelerators of the 755, so firmware that depends on AES/SHA/RSA hardware offload must be re-routed to software or to a discrete crypto IC. Pin-out and peripheral map are otherwise identical.

Is the STM32H755ZIT6 pin-compatible with STM32H753IIT6?

The STM32H755ZIT6 (LQFP-144) and STM32H753IIT6 (LQFP-176) are NOT pin-compatible because the package pin counts differ - 144 pins vs 176 pins on different land patterns. For LQFP-144 pin-compatible alternatives, ST recommends migrating to other STM32H755xI variants; for LQFP-176 applications, STM32H753XIH6 or STM32H745IIT6 share the same package and most peripherals.

When should I choose STM32H755ZIT6 over STM32H743IIT6?

Choose STM32H755ZIT6 when you need the second Cortex-M4 core to offload communication stacks, GUI rendering or real-time control in parallel with M7 DSP. If your application fits a single-core Cortex-M7 design without parallel task partitioning, the STM32H743IIT6 offers the same 480 MHz M7, 2 MB flash and LQFP-176 package at lower cost. The 755 is the right pick for HMI with motor control or audio + connectivity stacks.

Is STM32H755ZIT6 suitable for industrial HMI applications?

Yes, the STM32H755ZIT6 is explicitly designed for industrial HMI: it integrates a Chrom-ART 2D graphics accelerator, an LCD-TFT controller, a JPEG codec, 1 MB of SRAM for framebuffers, and the second M4 core to manage touch, communication and UI rendering in parallel with M7 application logic. ST reference designs use it with 4.3" to 7" WVGA TFT panels at 60 Hz without external graphics ICs.

What is the best GigaDevice equivalent for the STM32H755ZIT6?

As of 2026-10-10 there is no drop-in GigaDevice GD32 equivalent to the STM32H755ZIT6 because GigaDevice has not released a dual-core Cortex-M7/M4 part matching the 480 MHz M7 + 240 MHz M4 + 2 MB flash combination. GD32H7-series single-core 600 MHz parts and APM32 dual-core Cortex-M7/M4 parts from Geehy exist but do not share the LQFP-144 footprint. Verify any cross-brand claim against the LQFP-144 land pattern and peripheral map before substituting.

Where can I download the STM32H755ZIT6 datasheet PDF?

The official STMicroelectronics datasheet stm32h755zi.pdf is hosted at https://www.st.com/resource/en/datasheet/stm32h755zi.pdf and covers the full STM32H755xI line including the ZIT6 LQFP-144 variant. Mirror copies are available on datasheets.com and octopart.com. For full register-level details, request the RM0399 reference manual from ST directly - it is 200+ pages and complements the datasheet's parametric tables.

Where can I find the STM32H755ZIT6 pinout diagram?

The LQFP-144 pinout of the STM32H755ZIT6 is published in section 4 of the ST datasheet stm32h755zi.pdf and in the STM32H755xI pinout definition file on the ST website. Each pin lists alternate functions AF0-AF15 for the GPIO multiplexer, with dedicated assignments for Ethernet RMII/MII, USB OTG, SDMMC and SAI interfaces; the same datasheet also includes the package mechanical drawing with pin-1 indicator.

What are the key specifications of STM32H755ZIT6 that engineers should know?

Engineers evaluating the STM32H755ZIT6 should focus on six headline specs: dual-core 480 MHz Cortex-M7 + 240 MHz Cortex-M4, 2 MB dual-bank flash with read-while-write, 1 MB SRAM across DTCM/AXI/SRAM1-3 banks, 114 GPIO in LQFP-144, integrated SMPS for core efficiency, and hardware AES/SHA/RSA + TRNG crypto. Together these enable secure real-time HMI and edge-AI designs on a single die without external companion ICs.

Справочные инженерные данные для STM32H755ZIT6 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the STM32H755ZIT6 when your design requires a dual-core Cortex-M7/M4 architecture in a conventional LQFP-144 land pattern with hardware crypto acceleration for secure boot or TLS. It is the right pick for industrial HMI panels with real-time motor control, edge-AI vision/audio nodes, and secure IoT gateways in the 50-100 mA idle power envelope. If your design fits a single-core Cortex-M7 without parallel task partitioning, drop to the STM32H743IIT6 (LQFP-176) for cost savings. If your design does not need the crypto block, the STM32H745BIT6 (LQFP-144, 1 MB flash) shares the same land pattern and saves roughly 30% cost. If your PCB can accept a 176-pin LQFP, STM32H745IIT6 or STM32H753IIT6 add more GPIO but require a layout rework.

Сравнение с аналогами

Параметр	Этот товар	STM32H755BIT6	STM32H745BIT6	STM32H745IIK6	STM32H745IIT6	STM32H753IIT6
Brand	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Package	LQFP-144 (20x20 mm)	LQFP-144 - same	LQFP-144 - same	LQFP-176 (24x24 mm) - different	LQFP-176 (24x24 mm) - different	LQFP-176 (24x24 mm) - different
Core Architecture	Dual M7 480 MHz + M4 240 MHz	Dual M7 + M4 - same	Dual M7 + M4 - same	Dual M7 + M4 - same	Dual M7 + M4 - same	Single M7 480 MHz only
Flash Memory	2 MB	1 MB (-50%)	1 MB (-50%)	2 MB	2 MB	2 MB
SRAM	1 MB	1 MB - same	1 MB - same	1 MB - same	1 MB - same	1 MB - same
Hardware Crypto (AES/SHA/RSA)	Yes	Yes	No	No	No	Yes
GPIO Count	114	114	114	140 (LQFP-176)	140 (LQFP-176)	140 (LQFP-176)

Ключевые отличия

Only STM32H755 line member with hardware crypto accelerator on LQFP-144 (против STM32H745BIT6)
Dual-core topology enables deterministic real-time task partitioning (против STM32H743IIT6 (LQFP-176))
LQFP-144 land pattern supports conventional PCB assembly (против STM32H753XIH6 (TFBGA-176))

Заметки по проектированию

The STM32H755ZIT6 integrates a step-down SMPS for the core logic rail, but its inductor selection is critical: ST recommends a 4.7 µH shielded inductor with 30 mΩ DCR or better and a 4.7 µF X7R input plus 22 µF output capacitor. Inadequate inductor ripple will couple into the core VDD, causing the M7 to throttle or triggering spurious resets under heavy DSP load. Place the inductor within 10 mm of the VLX pin and keep its switched loop area under 25 mm².

Route the 480 MHz Cortex-M7 high-speed traces (SDMMC, SAI, SPI, Ethernet RMII) with impedance-controlled 50 Ω microstrips over a continuous ground plane, and place a 100 nF plus 1 µF ceramic decoupling pair within 5 mm of every VDD/VSS pair. For LQFP-144 routing, fan out the inner-row GPIO on both top and inner layers using vias-in-pad to escape the 0.5 mm pitch without violating DRC. Verify all crystal traces (HSE and LSE) are under 10 mm with ground shielding on both sides.

Dual-core 480 MHz operation can dissipate 500 mW to 800 mW, which is meaningful in a sealed enclosure. Estimated: at 480 MHz M7 + 240 MHz M4 with both cores 80% utilized, VDD=3.3 V and Tj=85 °C max, a minimum copper-pour area of approximately 600 mm² on a 4-layer 1 oz PCB is required to stay within thermal limits. Add thermal vias under the exposed pad region if migrating to the TFBGA variant.

The BOOT0 pin state at reset determines the boot source (user flash, system memory bootloader, or SRAM); leaving BOOT0 floating causes intermittent boot failures. Always strap BOOT0 with a 10 kΩ pull-down for normal operation or 10 kΩ pull-up to enter bootloader. Also configure the option bytes in the OB program before locking, because locking them with wrong values can brick the part until an external SWD programmer unlocks the RDP level.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Yes

Конфликтные минералы

Compliant

RoHS and REACH compliant per ST product page. Not AEC-Q100 qualified - STM32H755ZIT6 is industrial grade (-40 to +85 C). For automotive AEC-Q100 designs, use STM32H755ZIT6Q or migrate to STM32H7S automotive variants.

Данные проверены: 2026-10-10 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Manufacturer Product Page, Manufacturer Datasheet, Distributor, Octopart, Distributor

Связанные компоненты & термины

STMicroelectronics STM32H755ZIT6 STM32H755BIT6 STM32H745BIT6 STM32H745IIK6 STM32H745IIT6 STM32H753IIT6 STM32H743IIT6 Cortex-M7 Cortex-M4 dual-core MCU microcontroller LQFP-144 LQFP-176 Chroma-ART Accelerator LCD-TFT controller AES SHA RSA TRNG SMPS USB OTG Ethernet CAN FD SAI SDMMC RoHS REACH industrial HMI motor control edge AI