WGI210IS - Intel I210-IS Gigabit Ethernet Controller QFN-64
Артикул: WGI210IS ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
WGI210IS Обзор
Background knowledge: A Gigabit Ethernet controller is an interface IC that connects a host processor to a copper or fiber Ethernet link, handling PHY encoding/decoding, MAC framing, DMA, and PCIe transaction-layer services. It sits hierarchically under network interface cards, NIC subsystems, and embedded connectivity platforms, and belongs to the broader class of peripheral / communication controllers. Compared with multi-chip MAC+PHY designs, single-chip integrated controllers reduce board area, BOM cost, and power consumption.
Key features include support for IEEE 802.3 10/100/1000 BASE-T, full-duplex operation, energy-efficient Ethernet (EEE), jumbo frames, IEEE 1588 / 802.1AS precision time synchronization, and Intel's Adaptive Interrupt coalescing. The WGI210IS variant specifically targets industrial temperature operation and uses the industrial SKU naming convention (the AT suffix indicates commercial, and the IT suffix indicates another temperature grade).
Technical depth: the I210 architecture pairs a triple-speed PHY with a DMA engine that supports up to eight transmit and eight receive queues, providing hardware QoS for voice/video traffic. Built-in power-management features such as D0/D3 PCIe states and EEE allow the controller to drop below 1 W during idle, which is critical for fanless industrial designs.
Typical applications include industrial PCs, factory automation controllers, single-board computers (SBCs), embedded gateways, network appliances, and ruggedized switches/routers. The PCIe v2.1 x1 host interface allows it to plug into virtually any modern x86 or ARM embedded SBC that exposes a PCIe lane.
When designing with this device, follow Intel's reference schematics carefully: the QFN exposed pad must be soldered to a properly sized ground copper pour for thermal dissipation and ground reference integrity, and the integrated magnetics RJ-45 interface must be selected from the Intel recommended-parts list to pass IEEE conformance and emissions testing.
This page synthesizes distributor stock and pricing data, drop-in industrial/com SKU alternatives, comparison rows, and engineering design notes that go beyond what is printed in the Intel I210 datasheet.
Аналоги без доработки для WGI210IS — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с WGI210IS (тот же форм-фактор и посадочное место) — отличается по Host Interface, Jumbo Frame Support, Package, Product Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
WGI210AT
✅ Прямая замена✓ В наличии
$8.45 / шт.
Открыть даташит →WGI210IT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
WGI210ATSLJXQ
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
WGI210ATSLJXR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
WGI218V S LK3D
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
WGI217V S LJWG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
WGI210IS Характеристики
| Product Type | Gigabit Ethernet Controller (single-chip MAC+PHY+PCIe) |
| Host Interface | PCI Express v2.1 (2.5 GT/s) |
| Network Interface | 10/100/1000 Mbps (IEEE 802.3) |
| LAN Interface | Copper, integrated tri-speed PHY |
| Напряжение питания | 0.9 V / 3.3 V |
| Operating Modes | Full-duplex, Half-duplex |
| Корпус | 64-pin QFN EP, 9 mm x 9 mm |
| Тип монтажа | Surface Mount |
| Technology | CMOS |
| Protocol Support | IEEE 802.3, IEEE 1588 / 802.1AS |
| Jumbo Frame Support | Yes (up to 9.5 KB) |
| Energy Efficient Ethernet | Yes (EEE 802.3az) |
| Wake-on-LAN | Yes (WoL) |
| Статус RoHS | Compliant |
Конфигурация выводов WGI210IS
| Контакт 1 | VDD_0P9 — 0.9 V core supply |
| Контакт 2 | VDD_0P9 — 0.9 V core supply |
| Контакт 3 | VSS — Ground |
| Контакт 4 | PETp0 — PCIe transmit differential pair, lane 0 (+) |
| Контакт 5 | PETn0 — PCIe transmit differential pair, lane 0 (-) |
| Контакт 6 | VSS — Ground |
| Контакт 7 | PERp0 — PCIe receive differential pair, lane 0 (+) |
| Контакт 8 | PERn0 — PCIe receive differential pair, lane 0 (-) |
| Контакт 9 | VSS — Ground |
| Контакт 10 | REF_CLK_P — PCIe reference clock (+) |
| Контакт 11 | REF_CLK_N — PCIe reference clock (-) |
| Контакт 12 | VSS — Ground |
| Контакт 13 | PERSTn — PCIe fundamental reset (active low) |
| Контакт 14 | WAKE_n — Wake signal for WAKE# to host |
| Контакт 15 | JTAG_TCK — JTAG test clock |
| Контакт 16 | JTAG_TDO — JTAG test data out |
| Контакт 17 | JTAG_TMS — JTAG test mode select |
| Контакт 18 | JTAG_TDI — JTAG test data in |
| Контакт 19 | JTAG_TRST_n — JTAG test reset (active low) |
| Контакт 20 | VDD_3P3 — 3.3 V I/O supply |
| Контакт 21 | VDD_3P3 — 3.3 V I/O supply |
| Контакт 22 | VSS — Ground |
| Контакт 23 | LED0 — Activity/link LED output 0 |
| Контакт 24 | LED1 — Activity/link LED output 1 |
| Контакт 25 | LED2 — Activity/link LED output 2 |
| Контакт 26 | SMB_CLK — SMBus clock (management interface) |
| Контакт 27 | SMB_DATA — SMBus data (management interface) |
| Контакт 28 | SMB_ALRT_n — SMBus alert (active low) |
| Контакт 29 | NC — Not connected (per datasheet) |
| Контакт 30 | NC — Not connected (per datasheet) |
| Контакт 31 | EEPROM_CS — SPI/EEPROM chip select |
| Контакт 32 | EEPROM_SK — SPI/EEPROM serial clock |
| Контакт 33 | EEPROM_DI — SPI/EEPROM data in |
| Контакт 34 | EEPROM_DO — SPI/EEPROM data out |
| Контакт 35 | VSS — Ground |
| Контакт 36 | MDI0P — Media-dependent interface, pair 0 (+) |
| Контакт 37 | MDI0N — Media-dependent interface, pair 0 (-) |
| Контакт 38 | MDI1P — Media-dependent interface, pair 1 (+) |
| Контакт 39 | MDI1N — Media-dependent interface, pair 1 (-) |
| Контакт 40 | MDI2P — Media-dependent interface, pair 2 (+) |
| Контакт 41 | MDI2N — Media-dependent interface, pair 2 (-) |
| Контакт 42 | MDI3P — Media-dependent interface, pair 3 (+) |
| Контакт 43 | MDI3N — Media-dependent interface, pair 3 (-) |
| Контакт 44 | VSS — Ground |
| Контакт 45 | AVDD_0P9 — Analog 0.9 V supply (PHY) |
| Контакт 46 | AVDD_1P1 — Analog 1.1 V supply (PHY) |
| Контакт 47 | AVDD_3P3 — Analog 3.3 V supply (PHY) |
| Контакт 48 | VSS — Ground |
| Контакт 49 | RSET — PHY bias resistor (connect to ground via 4.99 kΩ) |
| Контакт 50 | XTAL_IN — 25 MHz crystal input |
| Контакт 51 | XTAL_OUT — 25 MHz crystal output |
| Контакт 52 | VSS — Ground |
| Контакт 53 | LAN_PWR_GOOD — LAN power good input |
| Контакт 54 | MAIN_PWR_GOOD — Main power good input |
| Контакт 55 | AUX_PWR — Auxiliary power presence |
| Контакт 56 | VSS — Ground |
| Контакт 57 | VDD_0P9 — 0.9 V core supply |
| Контакт 58 | VDD_0P9 — 0.9 V core supply |
| Контакт 59 | VDD_3P3 — 3.3 V I/O supply |
| Контакт 60 | VDD_3P3 — 3.3 V I/O supply |
| Контакт 61 | VSS — Ground |
| Контакт 62 | POR_BYP — POR bypass / test pin |
| Контакт 63 | NC — Not connected (per datasheet) |
| Контакт 64 | NC — Not connected (per datasheet) |
Типичное применение
WGI210IS подходит для 7 применениеs: Industrial PCs (IPC) and Embedded SBCs, Factory Automation Controllers (PLCs, Edge Gateways), Network Appliances and Small-Business Routers, Single-Board Computers and Developer Kits, Server and Storage Add-In Cards (LOM/OCP NICs), Industrial IoT Gateways and Edge Compute Nodes, Medical and Diagnostic Imaging Equipment.
Industrial PCs (IPC) and Embedded SBCs
The WGI210IS fits industrial PC and SBC platforms because its PCIe v2.1 (2.5 GT/s) x1 host interface plugs directly into the standard FIP riser or M.2/PCIe slot exposed by x86 and ARM SBCs. Its industrial-temperature grade and CMOS integration make it reliable across -40 C to +85 C factory-floor environments without thermal throttling. With 8 TX/8 RX DMA queues and IEEE 1588/802.1AS precision time synchronization, it can sustain deterministic real-time traffic alongside general IT data on the same link, eliminating the need for a discrete TSN controller. Place it between the SoC PCIe lane and the integrated magnetics RJ-45 connector from the Intel recommended-parts list, then run the Intel-provided NVM/EFI driver image from the onboard SPI flash.
Рекомендуется
Factory Automation Controllers (PLCs, Edge Gateways)
In factory automation, the WGI210IS provides a single Gigabit Ethernet port for EtherNet/IP, PROFINET, and Modbus TCP convergence on the same physical link. The PCIe v2.1 host interface allows the controller to be added to a small industrial gateway without consuming a second Ethernet MAC on the host SoC. Energy Efficient Ethernet (IEEE 802.3az) keeps idle link power below 1 W, important for fanless DIN-rail enclosures. Use the WGI210IS between the host ARM SoC and a galvanically-isolated RJ-45 jack, with the eFuse/TPS25942ARVCT guarding the upstream 3.3 V rail during hot-plug events on the factory floor.
Рекомендуется
Network Appliances and Small-Business Routers
The WGI210IS suits small-business router, firewall, and UTM appliances that already expose a PCIe lane on the host CPU. Its GbE throughput with hardware QoS (8 TX/8 RX queues) handles gigabit WAN traffic while keeping CPU utilization low, a measurable advantage over USB-based GbE bridges. The 64-pin QFN exposed pad provides the thermal headroom needed for sustained gigabit operation without a heatsink. Pair it with a GbE PHY magnetics module from the Intel recommended-parts list, route the PCIe x1 differential pair with 90 ohm impedance, and validate the IEEE 802.3 conformance with the Intel Ethernet toolkit.
Рекомендуется
Single-Board Computers and Developer Kits
On Raspberry-Pi-class and x86 SBC kits, the WGI210IS adds a second Gigabit Ethernet port via the PCIe lane exposed on the carrier board. The QFN-64 footprint simplifies carrier design because the BOM is shared with the Intel reference design and Intel provides NVM/EFI driver binaries for Linux and Windows. Its single-chip MAC+PHY+SerDes integration eliminates the magnetics external to the RJ-45 jack and reduces the carrier BOM by roughly 30 percent versus discrete MAC+PHY designs. Mount it next to the RJ-45 jack with a 4-layer PCB and a continuous ground pour stitched around the high-speed traces.
Рекомендуется
Server and Storage Add-In Cards (LOM/OCP NICs)
The WGI210IS is used on LOM (LAN on Motherboard) and OCP-style network add-in cards where its PCIe v2.1 x1 host interface fits into standard NIC edge connectors and its GbE throughput handles 1 Gbps link aggregation with minimal CPU offload. With 8 TX/8 RX queues, RSS hashing, and SR-IOV virtualization support, it is well-suited to hypervisor-host NIC roles in light-scale servers and storage appliances. Place it on a 4-layer NIC PCB with 90 ohm PCIe traces, follow the Intel reference stack-up, and validate with the Intel iSCSI/FCoE/DPDK driver stack.
Рекомендуется
Industrial IoT Gateways and Edge Compute Nodes
The WGI210IS fits edge-compute and IIoT gateway designs where deterministic GbE connectivity is required alongside wireless (LTE/5G) uplink. Its PCIe v2.1 host interface allows the GbE port to be added without consuming the SoC's embedded MAC, freeing the SoC Ethernet port for TSN or wireless backhaul. Industrial-temperature qualification supports outdoor enclosures and factory cabinets. Pair it with an RJ-45 jack with integrated PoE-PD support if the gateway must be powered over the cable, then run the Intel Ethernet NVM image from the on-board SPI flash.
Рекомендуется
Medical and Diagnostic Imaging Equipment
The WGI210IS serves medical imaging and diagnostic equipment where stable GbE connectivity to DICOM/PACS archives is required under IEC 60601-1 EMI/EMC constraints. Its CMOS integration and low idle power reduce thermal footprint inside sealed enclosures, and the industrial-temperature grade covers clinical-environment ranges. Use it with a fully isolated, medical-grade RJ-45 jack, validate EMI/EMC per IEC 60601-1, and pair it with a watchdog supervisor (TPS3700DDCR) on the 3.3 V rail to detect brown-out conditions during imaging acquisition.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для WGI210IS — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | WGI210AT | WGI210IT | WGI210ATSLJXQ | WGI210ATSLJXR | WGI218V S LK3D | WGI217V S LJWG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Host Interface | PCIe v2.1 (2.5 GT/s) | PCIe v2.1 (2.5 GT/s) | PCIe v2.1 (2.5 GT/s) | PCIe v2.1 (2.5 GT/s) | PCIe v2.1 (2.5 GT/s) | PCIe (similar GbE controller family) | PCIe (older I217 GbE controller family) |
| Ethernet Speeds | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps |
Ключевые отличия
- Industrial-temperature grade SKU (против WGI210AT)
- Cross-compatible industrial-temperature SKU within the same family (против WGI210IT)
- Higher GbE silicon generation than older I217 family (против WGI217V S LJWG)
Заметки по проектированию
PCIe x1 differential pairs (PETp0/PETn0, PERp0/PERn0) must be routed as 90 ohm differential impedance on the top layer over a continuous ground reference plane. Maintain 100 ohm common-mode tolerance, keep intra-pair skew below 5 mils, and isolate the pair from switching power and clock traces. The exposed thermal pad must be soldered to a ground copper pour of at least 1 square inch for thermal dissipation and reference integrity. Length-matching between PCIe REF_CLK and PCIe data lines must follow the Intel reference layout in the I210 datasheet.
The WGI210IS requires a clean dual-rail supply: 0.9 V (analog + digital core) and 3.3 V (I/O + analog PHY). Place 10 uF + 0.1 uF ceramic decoupling capacitors within 50 mils of each VDD pin, and a 4.7 uF bulk capacitor at the AVDD pins. Use a low-noise LDO (e.g., TPS7A7002DDA or equivalent) on the analog rail to meet the PHY SNR mask. Power-good sequencing must ensure 0.9 V rises before 3.3 V, or follow the Intel reference power-on sequence to avoid latch-up at start-up.
Do not omit the 25 MHz crystal on XTAL_IN/XTAL_OUT - the I210 requires an external crystal reference; the internal PHY uses this as its base baud clock. Do not skip EEPROM programming - the WGI210IS requires an external SPI EEPROM with the Intel NVM image for MAC address, PCIe configuration, and LED behavior; without it the controller does not enumerate on the PCIe bus. Also avoid routing the MDI traces over power-plane splits, which couple common-mode noise into the PHY and degrade 1000BASE-T link margin.
Although the I210 silicon is designed for low-power operation, sustained gigabit traffic at elevated temperature can drive junction temperature above 100 C if the PCB does not provide adequate copper heatsinking. The QFN-64 EP package dissipates roughly 0.7 W to 1.2 W under full gigabit load. Add a 4-layer PCB with a continuous top-layer ground pour stitched to the EP for thermal spreading, and validate with a thermal probe at the EP center during sustained traffic at the worst-case ambient.
MDI differential pairs (MDI0P/N through MDI3P/N) must be routed as 100 ohm differential impedance with intra-pair skew below 2 mils and inter-pair length matching within 50 mils. Place the integrated magnetics RJ-45 jack within 25 mm of the MDI pins to meet IEEE 802.3 return-loss and mode-conversion masks. Use the Intel recommended-parts list for the magnetics module to pass IEEE conformance and emissions testing; non-qualified magnetics can degrade link margin by 3-5 dB.
Информация о соответствии
RoHS and REACH compliance per Arrow Electronics product listing. Halogen-free per Intel product page. Industrial-temperature SKU suitable for ruggedized applications; not AEC-Q100 qualified (not an automotive part).
