FPGA at CPLD
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EP3C25F256C6N - 24,624-LC FPGA, 500 MHz | Altera
Altera EP3C25F256C6N is a Cyclone III field-programmable gate array with 24,624 logic elements, 156 I/O pins and a 256-pin low-profile ball grid array package. The device is associated with a 500 MHz operating figure and a 1.2 V supply specification, making it suitable for programmable control, interface, signal-processing and embedded-logic systems. Its industrial temperature range extends from -40°C to 125°C for applications requiring operation across extended temperature conditions. A field-programmable gate array, or FPGA, is a programmable semiconductor within the broader logic-device hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic blocks, programmable interconnect and configurable I/O in one device. Cyclone III devices use this architecture to support designs that can be updated after manufacture, allowing product revisions, hardware customization and field upgrades without changing the physical PCB. The EP3C25F256C6N combines 24,624 logic elements with 156 I/O pins, providing a substantial logic resource for parallel processing, control logic, protocol bridges and embedded system functions. Its 1.2 V supply specification and 500 MHz associated operating figure make it appropriate for designs that require considerably more programmable logic than a small programmable logic device. The 256-LBGA package also supports dense board layouts while exposing a high pin count for external interfaces. The C6 suffix identifies the device's speed grade within the Cyclone III family, while the 256 package suffix corresponds to the 256-ball package configuration. Device selection should include the logic budget, available I/O, pin assignment, memory requirements, clocking architecture, power budget and required design-tool support. The complete package pinout and electrical limits should be checked against the manufacturer datasheet before PCB routing or power-supply design is released. Typical uses include industrial automation controllers, communications interfaces, test and measurement equipment, embedded control systems and general-purpose digital signal-processing platforms. In each case, the FPGA allows parallel logic blocks to execute concurrently, which can shorten the implementation of control, acquisition and interface functions when a designer does not want to create a dedicated ASIC. A key design consideration is that an FPGA board must provide stable core and I/O supplies, clocking, configuration support and decoupling. Power estimation must cover logic utilization, switching activity, I/O standards and environmental conditions rather than relying only on a nominal device frequency. PCB signal-integrity planning is also essential because the 256-LBGA footprint requires careful escape routing and power-plane construction. This product record combines the device's principal logic, package, temperature and supply characteristics with application guidance, drop-in family alternatives and design cautions. Those engineering details help buyers identify whether the EP3C25F256C6N fits an existing design before requesting a quotation or beginning PCB work.
EP3C25F256C7 - 24,624 LEs Cyclone III FPGA | Altera
The Altera EP3C25F256C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 memory bits, and 256 I/O pins in a 256-LBGA package. It provides a programmable logic platform for embedded control, communications, signal processing, and industrial equipment where parallel programmable logic is required. The verified device record identifies 156 logic blocks and a -40°C to +125°C operating-temperature range. A field-programmable gate array is a semiconductor device whose digital logic, interconnects, and I/O behavior can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic IC, which is a semiconductor and a form of programmable digital hardware. Cyclone III devices combine configurable logic, embedded memory, and programmable I/O in a single integrated circuit, reducing the number of external components required in systems that need flexible hardware behavior or late design changes. The EP3C25F256C7 provides 24,624 logic elements, 608,256 memory bits, and 156 logic blocks. Its 256-LBGA package supports 256 device terminals and is identified as surface mount and lead-free in the supplied data. These resources make the device relevant to control logic, protocol bridging, test equipment, industrial automation, communications infrastructure, and embedded systems that require a reusable hardware platform. The operating range of -40°C to +125°C supports applications spanning industrial temperature environments. The Cyclone III architecture combines configurable logic blocks with embedded memory resources and programmable input/output structures. This allows design logic to be implemented in parallel rather than entirely as sequential processor instructions. The EP3C25F256C7 should be configured for its intended clocking, I/O standards, memory interface, and system timing before operation. Detailed voltage ratings, supported I/O standards, speed-dependent timing, configuration methods, and power consumption were not included in the verified records and must therefore be confirmed in the manufacturer device documentation before design release. Typical applications include industrial factory controllers, communication line cards, instrumentation and test systems, network-interface subsystems, embedded video control, and general-purpose digital signal-processing platforms. The 24,624 logic elements provide substantial parallel-processing capacity, while 608,256 memory bits can support buffering, lookup tables, packet storage, or state-machine data. The 256-terminal package also offers a broad interface footprint for external memory, transceivers, clocks, and data buses. A key design consideration is power and thermal planning. The verified data does not provide core voltage, I/O voltage, quiescent power, or active power, so engineers should not estimate those values from generic Cyclone III data without checking the exact device, speed grade, package, and configuration. Likewise, the 256-LBGA package requires a qualified PCB layout with controlled escape routing, power and ground distribution, thermal analysis, and assembly-process controls. Configuration storage, JTAG access, clocking, decoupling, and I/O standards must all be verified against the official documentation. This page combines the supplied distributor specifications, verified package and temperature details, available cross-reference candidates, and practical engineering cautions that are not consolidated in a typical distributor listing. It distinguishes verified characteristics from unavailable electrical details so engineers can assess fit, identify missing data, and plan a responsible migration or qualification process.
EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial
The Intel EP3C25F256C8 is a Cyclone III field-programmable gate array with 24,624 logic cells, a maximum frequency of 402 MHz, 65 nm process technology, a 1.2 V core supply, and a 256-pin FBGA package. It provides 156 user I/Os and 608,256 embedded-memory bits, making it suitable for moderately complex control, interface, signal-processing, and communications designs requiring reconfigurable logic. A field-programmable gate array is a semiconductor in the programmable-logic and semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA combines configurable logic, memory, and I/O resources on one device. The programmer can configure these resources after manufacture, allowing design revisions, field updates, and implementation of multiple digital functions without changing the PCB. The EP3C25F256C8 combines 24,624 logic cells with up to 156 I/Os in a compact 256-pin package. Its maximum stated operating frequency is 402 MHz, while its 1.2 V core voltage supports low-power digital implementations. The 65 nm fabrication process and 608,256 embedded-memory bits provide additional capacity for state machines, data buffers, control logic, and parallel processing pipelines. The Cyclone III architecture is intended to balance programmable functionality, device count, and cost. Because an FPGA combines fixed silicon with user-programmed configuration, design performance depends on the selected clocking, memory, I/O, and logic implementation. Engineers must also account for configuration setup, signal-integrity requirements, and the finite resources of the 24,624-cell device when partitioning larger system functions. Typical uses include industrial automation, networking equipment, embedded control, video and image processing, communications infrastructure, and test equipment. The device is appropriate when field programmability, short design cycles, or parallel hardware logic are more valuable than implementing the design with a fixed microcontroller or ASIC. When planning a PCB, engineers should follow the exact package drawing, ball map, power-supply requirements, and decoupling recommendations in the manufacturer datasheet. Designers should also verify the speed grade, temperature grade, configuration interface, clock topology, and I/O standards before releasing a production layout. This page consolidates verified device specifications, current distributor information, same-family drop-in alternatives, and application-focused engineering guidance. It adds practical package and sourcing context beyond a basic distributor listing while clearly separating verified facts from information that still requires manufacturer documentation.
EP3C25F256C8N - Cyclone III FPGA, 24.6K LEs, 256-FBGA | Intel
The Altera (Intel) EP3C25F256C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, packaged in a 256-pin FineLine BGA (FBGA-256) and offered in the commercial 0 to 85 C temperature range with the speed grade 8 designation. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O cells are defined at hardware description language (HDL) compile time and re-programmed in-circuit. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, sitting in the broader taxonomy as programmable logic > FPGA > SRAM-based LUT FPGA > low-power FPGA family. Key features include 156 user I/O pins, four general-purpose phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII, and 0.25 mW per logic element typical dynamic power consumption. The device operates from a 1.15 V to 1.25 V core supply, supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards, and is offered in a Pb-free 17 mm x 17 mm FBGA package with 1.0 mm pitch. Architecturally, the Cyclone III silicon uses a 60 nm process with a 4-input look-up table (LUT) based logic element, embedded M9K memory blocks, and 18x18 hardware multipliers optimized for digital signal processing (DSP) throughput. The device targets low-cost, high-volume designs where the balance between logic capacity, embedded memory, DSP bandwidth, and unit cost matters more than the highest serial transceiver data rate. Typical applications include industrial motor control, video surveillance and image processing, low-end protocol bridging, consumer display controllers, and entry-level software-defined radio (SDR) baseband processing. The wide I/O bank support also suits mixed-voltage board designs integrating 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals on the same PCB. When designing with this device, allocate sufficient PCB area for the 1.0 mm pitch BGA fan-out, route PLL analog supplies through a ferrite-bead-isolated rail, and configure unused I/O pins per the Cyclone III Hardware Reference to minimize leakage. Quartus II version 7.2 or later is required for synthesis, fitting, and configuration bitstream generation. This page synthesizes distributor pricing, exact-temperature speed-grade alternatives, and practical Cyclone III design notes not consolidated in the manufacturer datasheet, providing an engineer-facing summary for selection and procurement.
EP3C25F256I7 - 24,624-LC Cyclone III FPGA | Intel
The Intel EP3C25F256I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, a maximum stated frequency of 437.5 MHz, and a 1.2 V supply in a 256-pin FBGA package. It is a programmable digital-logic device within the FPGA, programmable-logic, semiconductor, and embedded-processing product hierarchy. The EP3C25F256I7 is suited to industrial, communications, control, signal-processing, and embedded interface designs that require deterministic parallel logic and reconfigurable hardware. An FPGA is a semiconductor whose internal digital circuit is defined by a configuration bitstream rather than fixed mask programming. Cyclone III devices combine programmable logic elements, embedded memory, general-purpose I/O, and dedicated resources such as multipliers and clock-management blocks. This architecture allows one physical PCB design to support multiple protocols, control sequences, or signal-processing functions by changing the configuration file rather than the silicon. Key device characteristics include 24,624 logic elements, 156 I/O, 608,256 bits of device memory, and a 65 nm fabrication process. The F256 package provides 256 contacts in a 17 mm by 17 mm square FBGA outline. The I7 ordering option denotes an industrial-temperature-oriented configuration, and the listed operating range extends from -40 °C to 100 °C at the junction. These attributes place the device between smaller programmable logic devices and larger FPGAs requiring more board area. The device integrates 594 Kb of block RAM according to its product listing, while the device-level memory organization shown elsewhere is 608,256 bits. Cyclone III FPGAs support parallel data paths, pipelined DSP operations, clock-domain control, and serial connectivity through configurable I/O. Because FPGA performance depends on the selected clock, memory interface, I/O standard, routing, and design constraints, a 437.5 MHz figure should not be interpreted as a guaranteed operating frequency for every logic design. Typical applications include industrial control and automation, communications infrastructure, audio and signal processing, data acquisition, network interface control, and embedded test equipment. In these systems, the FPGA can implement parallel protocols, state machines, packet handling, custom interfaces, or fixed-function signal pipelines while preserving upgrade flexibility through configuration updates. PCB implementation requires careful attention to the 256-ball BGA escape routing, power integrity, decoupling, clock jitter, and I/O voltage compatibility. The 1.2 V core and externally supported I/O standards must be matched to the connected circuitry. Designers should use the manufacturer pin and package documentation to assign balls, power groups, and configuration pins before releasing the board layout. This page combines device specifications, practical application guidance, package-focused design notes, and same-package alternatives for engineers evaluating the EP3C25F256I7. It also distinguishes confirmed attributes from parameters that must be checked in the Cyclone III documentation or a device-specific quote, helping teams make a technically defensible design and sourcing decision.
EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
The Intel (formerly Altera) EP3C25F256I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, 156 maximum user I/O pins, and 66 embedded 18x18 multipliers, housed in a 256-ball FineLine Ball-Grid Array (FBGA) package and operating from a 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications. Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention. Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends. Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required. When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin. This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.
EP3C25F324C6 - Cyclone III FPGA, 24624 LEs, 324-BGA
Altera EP3C25F324C6 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of memory, and 215 I/O in a 324-BGA package. The device uses a 65 nm CMOS process and is associated with a 1.2 V core voltage and operation up to 500 MHz. These characteristics place it in the FPGA and CPLD hierarchy, where programmable logic, embedded memory, and parallel I/O support configurable digital systems. A field-programmable gate array is a semiconductor whose digital behavior is defined after fabrication through configuration data rather than a fixed circuit mask. The Cyclone III family combines programmable logic blocks, general-purpose memory, and user I/O in one device. This makes an FPGA suitable when a design needs adaptable interfaces, parallel data processing, protocol bridging, or logic replication without fabricating a dedicated application-specific integrated circuit. The EP3C25F324C6 provides 24,624 logic elements and 608,256 bits of embedded memory. The listed 215 I/O count supports high-density connections to external memory, transceivers, converters, and control peripherals. The 500 MHz device speed grade indicates the maximum timing-performance class, although the operating frequency of a complete design still depends on the selected logic path, logic utilization, timing constraints, I/O standard, and board-level signal integrity. The device is manufactured on a 65 nm CMOS process and operates from a 1.2 V core supply. Its 324-BGA package provides a dense mechanical interface for multilayer printed circuit boards. The package pitch is listed as 1 mm with a 19 mm by 19 mm body in the device documentation. Correct assembly therefore requires a PCB land pattern and via arrangement capable of supporting the fine-pitch BGA geometry. Typical uses include industrial control and automation, communications infrastructure, embedded signal processing, data acquisition, and general-purpose logic prototyping. In these systems, the programmable architecture permits parallel interfaces and reusable control logic, while embedded memory can support buffering, packet handling, and data acquisition functions. The large I/O count is especially useful where a design must connect several buses or peripheral devices simultaneously. Design with the EP3C25F324C6 by checking every bank voltage and pin assignment against the selected configuration scheme. Maximum I/O availability can vary by package and configuration mode, so the device pin-assignment table should be treated as authoritative. Decoupling, layer transitions, ball escape routing, and BGA assembly constraints also require close review before a four-layer or multilayer board is released. This product page combines the exact EP3C25F324C6 device identity, package information, searchable sourcing questions, same-family alternatives, and practical FPGA design considerations. It also distinguishes verified device facts from parameters that require the manufacturer handbook, pin-assignment files, or Quartus implementation results for final design validation.
EP3C25F324C6N - Cyclone III FPGA 25K LE 215 I/O 324-BGA | Intel
The Intel (formerly Altera) EP3C25F324C6N is a Cyclone III family field-programmable gate array (FPGA) featuring 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, housed in a 324-ball fine-pitch BGA (FBGA-324) package with 215 user I/O pins. The 'C6' speed grade targets commercial 0C to +85C operation, while the 'N' suffix denotes a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic function is defined by user-loaded configuration bitstreams rather than fixed mask layers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). Cyclone III specifically targets low-cost, low-power, high-volume designs and is fabricated on TSMC's 65 nm low-power process, positioning it between traditional CPLDs and high-end FPGAs in the power/cost/performance envelope. Key differentiating features of the EP3C25F324C6N include four general-purpose PLLs, 66 dedicated DSP blocks (each capable of 18x18 multiply-accumulate operations), support for external memory interfaces including DDR/DDR2/QDRII, and up to 215 user I/O pins arranged across eight I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device supports both passive serial and fast passive parallel configuration schemes via industry-standard EPCS or EPCQ flash memories. Architecturally, the Cyclone III device family combines a fabric of logic array blocks (LABs) each containing 16 logic elements, a row/column interconnect mesh, embedded SRAM blocks (M9K), and dedicated multiplier/DSP blocks. The TSMC low-power process and Cyclone III's silicon-level power optimizations deliver static power consumption typically below 100 mW in idle configurations - substantially lower than competing FPGAs in this density range. Typical applications for the EP3C25F324C6N include industrial control and machine vision, automotive infotainment and driver assistance subsystems, low-cost video processing pipelines, software-defined radio front-ends, motor control, and embedded display controllers. Its combination of moderate logic density, generous memory bandwidth, and a small-footprint BGA makes it especially attractive for space-constrained cost-sensitive designs. When designing with this FPGA, plan power sequencing for the VCCINT core rail (1.2 V typical) and the VCCIO bank rails separately, and budget for in-rush current during configuration. Designers should also verify JTAG chain integrity before final board bring-up and use the Quartus II design suite (12.0sp2 or later) with the Cyclone III device library for compilation, place-and-route, and timing closure. This page synthesizes distributor inventory, drop-in compatible Cyclone III variants, and practical PCB power-integrity guidance not found in the standalone manufacturer datasheet, providing engineering value beyond what is available on DigiKey or Mouser product listings.
EP3C25F324C7 - 25K Logic FPGA, 215 I/O, 324-BGA | Intel
The Intel EP3C25F324C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 memory bits, 215 I/O, and a 324-BGA package. It is a surface-mount programmable-logic device intended for embedded systems requiring configurable parallel interfaces, control logic, and general-purpose digital processing. The device is identified in distributor data as the EP3C25F324C7 Altera Cyclone III FPGA and is offered for purchase through multiple authorized or secondary channels. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. In the product hierarchy, an FPGA belongs to programmable logic, which is a category of integrated circuit used to implement control, interface, signal-processing, and data-routing functions. Unlike a fixed-function application-specific integrated circuit, a Cyclone III FPGA can be programmed for multiple system behaviors and updated when design requirements change. The supplied distributor specifications identify 24,624 logic elements and 608,256 memory bits for this device. Its 215 I/O provide substantial board-level connectivity for parallel buses, counters, timers, status and control signals, and general-purpose digital interfaces. The EP3C25F324C7 uses a 324-BGA package, supporting compact surface-mount PCB construction while requiring careful ball-layout, assembly, and thermal-design planning. Cyclone III devices belong to Intel's programmable-logic portfolio and are commonly evaluated for embedded control, industrial automation, communications, instrumentation, and consumer-electronics designs. The EP3C25F324C7 suffix identifies a particular member of the EP3C25 device family and package combination. Because the supplied search data does not include the complete ordering-information table, exact speed-grade, temperature-grade, core-voltage, and legacy-versus-current status distinctions are marked as needed rather than inferred from the suffix. Potential applications include industrial control boards, programmable logic instruments, communication interfaces, test equipment, and embedded systems requiring substantially more I/O than a microcontroller may provide. In such designs, the FPGA can execute parallel state machines, merge or format data streams, coordinate multiple peripherals, and implement deterministic hardware timing. Tool-chain and device support must be confirmed against the applicable Intel Quartus or legacy Altera device-support package before committing to production. PCB implementation should follow the exact package ball map and power-plane requirements from the official device documentation. BGA soldering requires an appropriate land pattern, stencil design, reflow profile, X-ray or X-ray-equivalent assembly inspection, and sufficient via-in-pad or thermal-via strategy where warranted. Designers should also verify that every connected I/O standard, bank voltage, clock input, configuration source, and decoupling requirement is supported by the selected board revision. This product page consolidates the supplied distributor inventory, package and logic-resource details, verified same-family alternatives, comparison points, and implementation cautions into a design-focused reference. Because the provided evidence does not include a manufacturer datasheet URL or complete electrical tables, unsupported ratings and pin assignments are explicitly identified instead of being estimated.
EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel
Intel EP3C25F324C7N is a Cyclone III field-programmable gate array containing 24,624 logic cells, 608,256 bits of embedded memory, and 215 available I/O pins. The verified data identifies a 437.5 MHz device built on 65 nm technology with a 1.2 V core supply and a 324-ball FBGA package. It is a programmable-logic IC intended for engineers implementing configurable digital logic, interface bridging, control processing, and application-specific signal processing. A field-programmable gate array, or FPGA, is a semiconductor device whose logic functions are defined by configuration rather than fixed internal connections. Its hierarchy extends from programmable logic cells to configurable interconnects, embedded memory, I/O blocks, and a complete programmable-logic IC. Unlike an ASIC, an FPGA can be reprogrammed during development and after deployment. Compared with a fixed microcontroller, an FPGA generally provides parallel hardware execution and finely timed I/O, while trade-offs include higher power consumption, configuration requirements, and more complex implementation software. The principal verified resources are 24,624 logic cells and 608,256 memory bits, with 215 I/O pins available for external connectivity. The 324-ball FBGA package supports a substantial number of package-level connections while using surface-mount assembly. The supplied data also identifies a 437.5 MHz frequency and 65 nm process technology. These resources make the device suitable for datapaths that need more concurrent logic than a small programmable device but do not justify the cost and development cycle of a custom ASIC. Cyclone III architecture combines programmable logic arrays, routing resources, embedded memory, and programmable I/O elements. A design is captured with an FPGA development flow, synthesized into logic, mapped and placed onto available resources, routed through the device interconnect, and then loaded into configuration memory. Engineers must analyze timing closure, power, signal integrity, and configuration implementation together; an apparently efficient register-transfer design can still fail timing if fan-out, routing congestion, or unsuitable I/O constraints are ignored. Typical uses include industrial control, communications equipment, video or imaging preprocessing, test and measurement, and legacy interface emulation. The combination of 24,624 logic cells, 608,256 embedded memory bits, and 215 I/Os is relevant to glue-logic aggregation, protocol conversion, parallel acquisition, and state-machine-rich controllers. For a new high-volume product, however, lifecycle, migration, and total-cost studies are important before committing the design. PCB design should prioritize continuous power distribution, controlled-impedance connections, and clean clock routing. Because the available verified data does not provide detailed electrical limits, pin functions, configuration-interface requirements, thermal limits, or package dimensions, those values must be confirmed from the manufacturer datasheet before schematic release. Do not infer BGA ball assignments from the package name alone. This product page combines verified distributor specifications, availability signals, package context, and transparent engineering notes. Pricing is reported as of 2026-09-09, while distributor stock and lead time remain dynamic. The manufacturer ordering code, package, device family, logic-cell count, embedded memory, I/O count, process node, supply voltage, and frequency are the attributes most useful for initial device selection.
EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel
The Intel (formerly Altera) EP3C25F324C8 is a member of the Cyclone III family of low-power FPGAs fabricated on a 65 nm process, offering 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/Os in a 324-ball FineLine BGA package. It operates from a 1.2 V core supply with separate I/O bank supplies and supports commercial temperature grade (0 °C to +85 °C) at speed grade 8, with a maximum internal clock frequency of approximately 402 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit between fixed-function ASICs and microcontrollers in the digital design hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> low-power FPGA. Cyclone III FPGAs are specifically engineered for cost- and power-sensitive applications, building on the Cyclone architecture with a 65 nm process to reduce static and dynamic power while maintaining sufficient logic density for mid-range designs. Key specifications of the EP3C25F324C8 include 66 embedded 18 x 18 multipliers for DSP workloads, four general-purpose PLLs for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates 24624 logic elements organized as 1539 logic array blocks (LABs), with each LAB containing 16 logic elements. The embedded memory is configurable as RAM, ROM, or FIFO, providing flexible on-chip data buffering without external SRAM. The Cyclone III architecture supports partial dynamic reconfiguration and ships with free Quartus II design software, including IP cores for DDR/DDR2 SDRAM controllers, PCI Express, Ethernet, and common serial protocols. The 324-ball FineLine BGA package measures 19 mm x 19 mm with a 1.0 mm ball pitch, making it compatible with standard multilayer PCB manufacturing. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototypes, low-cost software-defined radio, and bridge/interface glue logic. It is also used as a prototyping vehicle for ASIC verification and as a low-volume production replacement for legacy CPLDs. When designing with this part, attention to simultaneous switching output (SSO) noise and decoupling is critical; the application notes recommend 0.1 µF and 0.01 µF high-frequency capacitors within 100 mils of each power pin. Migration paths include the Cyclone IV E family for cost reduction and Cyclone V for higher logic density. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, supporting faster engineering decisions.
EP3C25F324C8N - 24,624 LEs Cyclone III FPGA, 324-BGA | Intel
The Intel EP3C25F324C8N is a Cyclone III family Field Programmable Gate Array (FPGA) IC integrating 24,624 logic elements, 215 user I/O pins, and approximately 608 Kbits of embedded SRAM in a 324-ball FineLine BGA package. It is built on a low-power 60-nm process and operates with core logic at 1.2 V while supporting multiple I/O standards on its LVDS/LVCMOS/LVTTL banks. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions in silicon by loading a configuration bitstream. In the broader IC taxonomy, an FPGA sits below an ASIC in performance but above a microcontroller in flexibility, making it the workhorse for prototyping, low-volume custom logic, and parallel signal processing in industrial, communications, and test equipment. Key features of the EP3C25F324C8N include 66 embedded 18x18 multipliers for DSP, four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 8 in the suffix indicates the device speed grade, while the C denotes the commercial 0 C to +85 C operating range. Compared with earlier Cyclone generations, this part delivers roughly 4x the logic capacity and significant power-per-LE reductions. Typical applications span industrial motor and motion control, video processing pipelines, software-defined radio front-ends, telecom line cards, and ASIC prototyping platforms where the 215 I/O allow dense glue-logic integration with multiple parallel buses. Designers should plan for JTAG-based configuration via a 10-pin header or Altera USB-Blaster download cable, place at least four 0.1 uF and one 10 uF decoupling capacitor near each power pin group, and consult the Cyclone III device handbook for I/O-bank VCCIO planning. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical board-level design notes not collected in any single datasheet, giving engineers a one-stop reference for sourcing and second-sourcing this part.
EP3C25F324I7 - Cyclone III FPGA, 24624 LEs, 324-FBGA | Intel
The Intel EP3C25F324I7 is a low-power, low-cost Field Programmable Gate Array from the Cyclone® III family, featuring 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a TSMC 65nm low-power process and operates at a core voltage of 1.2 V with maximum toggle performance around 437.5 MHz. The 'I7' speed grade and industrial temperature range (-40°C to +100°C junction) make it suitable for thermally constrained and environmentally demanding designs. A Cyclone III FPGA is a programmable logic device that sits in the broader hierarchy of digital semiconductors (FPGA -> programmable logic -> ASIC alternative -> semiconductor). Unlike fixed-function ASICs, the logic function, memory configuration, and I/O behavior of an FPGA are defined at boot time by a configuration bitstream loaded from external flash, allowing one silicon platform to be reused across many product variants. Cyclone III was specifically engineered to balance logic density, DSP capability (66 embedded 18x18 multipliers), and static power consumption, displacing ASICs and ASSPs in cost-sensitive high-volume applications. Key technical features of the EP3C25F324I7 include 4 PLLs for clock management, 20 global clock networks, 66 embedded 18x18 multipliers, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 1.2 V core draws substantially lower static power than the previous Cyclone II generation, while still offering LVDS, LVPECL, SSTL, HSTL, and LVCMOS I/O standards through 8 I/O banks. Configuration can be loaded via passive serial (PS), active serial (AS), or JTAG, and the device includes built-in CRC and decompression for the bitstream. Typical applications span industrial motor control, video surveillance, automotive infotainment prototypes, low-cost software-defined radio, video processing pipelines, and PCIe endpoint prototyping (using the embedded transceivers in some Cyclone III variants or soft IP cores for GPIO-based implementations). The combination of high logic density and embedded multipliers also suits DSP front-ends such as motor-control FOC loops or multi-channel audio processing. When designing with the EP3C25F324I7, engineers must supply the four power rails (VCCINT, VCCA, VCCIO per bank, VCCD_PLL) with proper decoupling and follow Intel's pin-out guidelines for the FBGA-324 footprint. Quartus II Web Edition provides synthesis, place-and-route, and timing analysis. Note that Cyclone III is now in Intel's product lifecycle as a mature, NRND device, so designers building new platforms should evaluate Cyclone IV/V/E10AX equivalents or pin-compatible successors for long-term availability.
EP3C25F324I7N - Cyclone III FPGA, 24,624 LEs, 324-FBGA | Intel
The Intel (formerly Altera) EP3C25F324I7N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 24,624 logic elements, 608,256 bits of embedded RAM, and 66 embedded 18x18 multipliers in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. It supports up to 215 user I/O pins (66 LVDS pairs) and is rated for an industrial operating temperature range of -40C to +100C, making it well-suited for cost-sensitive, volume-driven designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to implement arbitrary digital logic functions through configurable logic blocks (LBs/LEs), programmable routing, and dedicated hard IP blocks such as memory and DSP. In the programmable-logic taxonomy, FPGAs sit alongside CPLDs as the highest-density user-configurable devices, falling under digital ICs > programmable logic > FPGA > CPLD hierarchy. Cyclone III sits at the low-power, low-cost end of Intel's FPGA portfolio, optimized for ASIC-replacement, glue-logic consolidation, and parallel DSP workloads. Key features include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and configuration via active serial (AS), passive serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The device operates from a 1.2 V core supply and supports I/O bank voltages of 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL). The 1.2 V core and 65 nm process deliver a typical power reduction of up to 50% versus the previous-generation Cyclone II family. The architecture combines LABs (Logic Array Blocks) of 16 LEs each with M9K memory blocks (9 Kbits each) distributed across the fabric, enabling efficient implementation of FIFOs, shift registers, and small ROM/RAM functions. The hard 18x18 multipliers accelerate DSP algorithms such as FIR filters, FFTs, and motor-control loops without consuming general-purpose fabric. Cyclone III's deterministic routing fabric and Quartus II / Quartus Prime design flow support rapid design iteration and proven IP libraries. Typical applications include industrial motor control and factory automation, video processing and image sensor bridging, automotive infotainment and driver-assistance subsystems, telecommunications line cards, and portable medical instrumentation. Its combination of low static power (~100 mW typical) and moderate logic density makes it a strong fit for volume designs where a low-cost CPLD would be too small and a high-end Stratix FPGA would be over-spec. When designing with this device, validate signal-integrity and length-matching rules for DDR2/QSPI interfaces early, and ensure the 1.2 V core rail uses a low-noise LDO (such as an LDO from the LDO regulator family) to meet the core voltage tolerance. Confirm BGA fanout and via-in-pad manufacturing capability with the assembly house before committing the PCB layout. This page synthesizes distributor pricing, drop-in alternatives, comparison data and practical design notes not found on any single manufacturer or distributor page, including a cross-reference comparison with EP3C25F256I7N and EP3C16F484I7N from the same Cyclone III family.
EP3C25Q240C8 - Cyclone III FPGA, 24624 LE | Intel
The Intel (Altera) EP3C25Q240C8 is a 24,624-logic-element Cyclone III FPGA with 608,256 RAM bits and 148 user I/Os, packaged in a 240-pin PQFP/BFQFP. The device has a reported internal operating frequency of about 472 MHz to 472.5 MHz and is identified as a commercial temperature, speed grade 8 version. This QFP package provides a 34.60 x 34.60 mm body, 4.10 mm height, and 0.50 mm pitch, offering a lower assembly cost alternative to BGA packages. An FPGA, or Field Programmable Gate Array, is an integrated circuit whose logic fabric can be configured after manufacturing to implement custom digital circuits. FPGAs sit above ASICs in flexibility and below MCUs in sequential processing convenience: instead of executing software instructions, an FPGA creates parallel hardware logic such as counters, state machines, DSP datapaths, memory controllers, and bus interfaces. The EP3C25Q240C8 belongs to the Cyclone III family, which is optimized for low-cost, high-volume applications requiring substantial programmable logic with moderate power consumption. Key verified parameters include 24,624 logic elements, 608,256 total RAM bits, 148 user I/O signals, a 240-lead PQFP/BFQFP package, and a maximum internal frequency of approximately 472.5 MHz. These values are captured from distributor and datasheet-aggregator listings. The 240-pin package supports enough external connections for broad interfacing while remaining routeable on conventional low-cost multilayer PCBs. The 0.50 mm lead pitch and 34.60 x 34.60 mm body allow standard surface-mount assembly equipment to be used throughout production. Cyclone III devices implement their programmable fabric using look-up-table-based logic elements, dedicated memory blocks, and embedded multiplier resources. In this EP3C25 density, the 608,256 RAM bits provide local data storage and FIFO support, while the logic elements allow parallel functions to operate at internal clock rates approaching 472 MHz. The commercial-grade C8 version is typically used in controlled indoor environments where high-speed data processing, protocol bridging, and custom state-machine logic must be implemented without the non-recurring engineering cost of an ASIC. Typical applications include industrial automation control, communication protocol bridging, video and image processing, laboratory instrumentation, medical diagnostics, and edge-oriented FPGA systems. The high I/O count and moderate density make the EP3C25Q240C8 a practical bridge between low-end CPLDs and larger, more expensive FPGAs. For systems requiring a Nios II soft processor, the RAM and logic resources are also sufficient to implement small embedded processor subsystems alongside custom peripherals. When designing with the EP3C25Q240C8, verify the exact core and I/O supply voltages from the Cyclone III device handbook, and place decoupling capacitors close to every power pin. Because the part is an SRAM-based FPGA, a configuration memory such as an EPCS or EPCQ device, or a JTAG download path, is mandatory for a self-starting board. Plans for speed grade, temperature range, and lead-free assembly should be confirmed before layout begins. This page synthesizes distributor-level pricing, drop-in EP3C25 family alternatives, and practical FPGA board design notes that are not all present on a standard distributor product page. It is intended to give engineers a compact starting point for procurement and design review while directing them to the official Cyclone III documentation for detailed electrical specifications.
EP3C25Q240C8N - 25K LE Cyclone III FPGA | Intel
Intel EP3C25Q240C8N is a Cyclone III field-programmable gate array built on 65 nm technology, providing 24,624 logic elements, 608,256 bits of embedded memory, and 148 user I/O in a 240-pin BFQFP package. It operates from a 1.2 V core supply and is specified for a maximum frequency of 402 MHz in the supplied reference data. The C8 speed grade makes this member suitable for cost-sensitive applications that still require a substantial programmable-logic fabric. A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, embedded memory, and input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture. It therefore occupies the semiconductor hierarchy between programmable logic devices and custom digital ICs, allowing engineers to implement interfaces, control logic, signal processing, and bus functions without a fabrication run. The principal Cyclone III resource is 24,624 logic elements for combinational and sequential digital functions. The device also integrates 608,256 memory bits, giving designers capacity for FIFOs, lookup tables, buffering, and control-state storage. With 148 I/O, the EP3C25Q240C8N supports many board-level interfaces. The 240-pin BFQFP package uses through-hole leads rather than a fine-pitch surface-mount ball grid, which can simplify inspection, prototyping, and legacy assembly processes. Architecture and technology determine the balance between programmable density, power, and performance. The listed 65 nm process and 1.2 V core supply characterize the Cyclone III generation, while the 402 MHz specification describes a maximum reference frequency rather than a guarantee for every customer design. Actual performance depends on logic placement, routing, clock resources, I/O standards, timing constraints, and power-supply integrity. The FPGA also supports boundary-scan testing, allowing pin connections to be checked without physical probes. Typical applications include industrial control, legacy communication equipment, test and measurement hardware, motor-control interfaces, and embedded systems requiring replaceable or updateable logic. It is particularly relevant where a 240-pin through-hole FPGA is already designed in, such as an upgrade or lifecycle-support board. Engineers can use it to consolidate board functions, implement a custom peripheral, or reproduce obsolete interface behavior. Design planning should begin with the target package, configured I/O count, required speed grade, available configuration interface, and supported power rails. Verify every pin, bank voltage, configuration mode, and timing constraint against the manufacturer documentation before schematic release. For production, assess configuration storage, JTAG access, decoupling, thermal behavior, and the availability of compatible design software and bitstream generation tools. This product data combines the supplied manufacturer and distributor specifications, package constraints, verified commercial references, and a conservative cross-reference assessment. Because no verified pin-compatible drop-in alternative was identified, the replacement list is intentionally limited rather than padded with footprint-changing devices.
EP3C25Q240I8N - Cyclone III FPGA, 25K LEs, 240-Pin PQFP | Intel (Altera)
The Intel (formerly Altera) EP3C25Q240I8N is a Cyclone III low-cost Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP / FQFP) package with gull-wing leads, offering 24,624 logic elements, 66,432 total registers, and 24624 logic cells organized into 1,539 Configurable Logic Blocks (CLBs). The device operates from a 1.2 V nominal core supply and is rated for the industrial temperature range of -40C to +100C, making it well suited to factory-floor, outdoor, and ruggedized embedded applications. As a member of the Cyclone III family, the EP3C25 occupies the low-power, low-cost tier of Altera's 65 nm FPGA portfolio, balancing logic density, on-chip memory, and DSP block count at a price point optimized for volume production. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated hardware blocks such as multipliers and block RAM into a single semiconductor IC. Within the broader taxonomy, FPGAs sit alongside microcontrollers and ASICs as flexible compute substrates: an FPGA is more power-efficient than a CPU at fixed parallel workloads, and faster to deploy than an ASIC at low-to-medium volumes. Cyclone III devices specifically target cost-sensitive applications such as industrial control, video bridging, and consumer electronics where designers need hardware-level parallelism without ASIC NRE cost. Key features of the EP3C25Q240I8N include 594 Kbits of embedded RAM distributed across M9K blocks, 66 embedded 18x18 multipliers for DSP operations, up to 148 maximum user I/O pins, and support for common configuration schemes including JTAG, Active Serial, and Passive Serial. The 240-pin PQFP body is surface-mountable but retains through-hole-style lead footprints, simplifying prototyping on 2-layer boards and hand-rework for low-volume builds. The Cyclone III architecture also embeds PLLs for clock management and supports LVDS, LVTTL, SSTL, and other I/O standards directly from the core without external transceivers. Typical applications include industrial motor control, video processing and image aggregation, low-cost software defined radio front-ends, factory automation backplanes, and bridge logic between legacy microcontrollers and modern high-speed buses. The combination of 24K logic elements with on-chip DSP multipliers is enough to implement H.264 encoding engines, multi-channel UART bridges, or a soft RISC-V core alongside customer-specific glue logic. Industrial -40C to +100C rating and the easy-to-solder PQFP package make this device attractive for long-life industrial designs. When designing with the EP3C25Q240I8N, allocate at least four PCB layers for proper power-plane decoupling of the 1.2V VCCINT rail, and use a JTAG header for in-system programming. Pair the device with an Altera/Intel EPCS serial configuration flash such as EPCS16 or EPCS64, and always include a dual-footprint option for migration to the larger Cyclone III variants if design requirements grow. This page consolidates distributor pricing, drop-in alternatives, and design notes not found on the bare datasheet.
EP3C25U256C6 - 24,624 LEs Cyclone III FPGA | Intel
The Intel EP3C25U256C6 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of embedded memory, 156 I/O, a 1.2 V supply requirement, and a maximum stated clock frequency of 472.5 MHz. It is packaged in a 256-ball LFBGA measuring approximately 14 mm by 14 mm with a 0.80 mm ball pitch. A field-programmable gate array, or FPGA, is a programmable semiconductor in which digital logic is configured after fabrication. An FPGA belongs to the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Cyclone III devices combine configurable logic blocks, embedded RAM, programmable input/output resources, and dedicated clock and power-management circuitry, allowing one package to implement control, interface, signal-processing, or communications functions. Key device attributes include 24,624 logic cells, 156 I/O, and 608,256 embedded-memory bits. The 156 I/O support board-level connections to external memory, interfaces, converters, and digital control signals. The 256-LFBGA package provides dense PCB routing and adequate clearance for high-speed design work, although its fine 0.80 mm pitch demands careful fanout, assembly planning, and inspection. The EP3C25U256C6 operates from a 1.2 V supply and is identified with a C6 speed designation. Its stated maximum clock frequency is 472.5 MHz, while the operating temperature shown in product information reaches 85°C. These figures make the device suitable for designs requiring substantial programmable logic and memory in a single compact package. Designers must still evaluate timing closure, power integrity, thermal behavior, and I/O standards for the target system. Typical applications include industrial control systems, communications infrastructure, video and image processing, embedded instrumentation, and general-purpose digital signal processing. In each case, designers select the device based on logic capacity, pin availability, memory requirements, clock targets, supported interfaces, and the toolchain needed to implement and verify the design. A critical implementation consideration is the dense 256-ball land pattern. Route power and ground with low-impedance planes, keep sensitive clock and configuration paths short, follow the manufacturer’s pin-connection and decoupling guidance, and verify the assembled board for shorts and assembly defects before programming. This product record combines the device’s principal electrical, logical, packaging, and thermal characteristics with application guidance, same-family migration options, and practical PCB considerations. It supports faster initial part screening while directing final selection work toward the manufacturer datasheet and the specific system requirements.
EP3C25U256C7 - 24,624-LE 437.5MHz Cyclone III FPGA | Altera
Altera EP3C25U256C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 156 I/O pins, 608,256 bits of memory, a 437.5 MHz maximum operating frequency, and a 256-LFBGA package. Designed around a 65 nm process and 1.2 V core supply, the device combines programmable logic, embedded memory, and general-purpose I/O in a surface-mount FPGA package. A field-programmable gate array, or FPGA, is a programmable-logic semiconductor whose digital circuits are defined through a configuration bitstream rather than a fixed mask set. Within the device hierarchy, the EP3C25U256C7 belongs to the Cyclone III FPGA family, the logic-device segment of programmable semiconductors. Its 24,624 logic elements provide substantially more configurable logic than small CPLDs, while the 256-LFBGA package supports dense board layouts in communication, control, instrumentation, and embedded-processing systems. The principal device characteristics include 24,624 logic cells, 156 I/O pins, and 608,256 bits of embedded memory. The reported 437.5 MHz operating frequency provides a useful indication of the device's high-speed logic capability, although final system timing depends on the selected speed grade, design constraints, I/O standards, and external timing paths. The 65 nm fabrication process and 1.2 V supply identify the device as a low-voltage Cyclone III implementation. The EP3C25U256C7 integrates programmable logic blocks, embedded RAM, dedicated PLL resources, and general-purpose I/O into one device. Its 156 I/O pins can be assigned according to the board-level interface requirements, while its embedded memory supports buffering, packet handling, data acquisition, and control-plane storage. Configuration data establishes the implemented circuit after power-up, allowing one physical board design to support multiple logic configurations and field upgrades. Typical applications include industrial automation, communications infrastructure, test and measurement, embedded control, and general-purpose digital signal processing. In an industrial controller, the FPGA could combine parallel sensor interfaces, protocol conversion, and real-time control logic. For communications equipment, its 156 I/O and 608,256 bits of memory can support data framing, buffering, and interface management. In instrumentation, multiple parallel channels can be synchronized while programmable logic handles acquisition and preprocessing. The most important design consideration is that FPGA replacement is not limited to matching package dimensions. A drop-in candidate must also match the voltage configuration, speed grade, temperature grade, configuration scheme, supported I/O standards, and power-supply requirements. The 256-LFBGA package also requires a land pattern capable of supporting its fine-pitch balls, careful power and ground distribution, and thermal-aware PCB layout. This page consolidates the verified EP3C25U256C7 specifications, distributor pricing, same-family drop-in candidates, and practical selection guidance. It also separates documented values from information that remains unavailable in the supplied source data, allowing engineers to verify every critical design constraint before procurement or schematic approval.
EP3C25U256C8 - 24,624-LE 472.5 MHz FPGA | Intel
The Intel/Altera EP3C25U256C8 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of memory, 156 I/O, and a 472.5 MHz operating frequency in a 256-ball UBGA package. It combines a programmable logic architecture, embedded memory, and digital interfaces on a single CMOS semiconductor device, making it suitable for industrial control, communications, signal processing, and embedded systems. An FPGA is a reconfigurable digital integrated circuit whose logic, memory, and interconnect resources can be programmed after manufacture. Within the semiconductor hierarchy, the EP3C25U256C8 belongs to the field-programmable gate array family, where an FPGA provides more flexible parallel logic density than a fixed-function application-specific integrated circuit. This flexibility supports design updates, product differentiation, and consolidated implementation of multiple digital functions on one device. Key device parameters include 24,624 logic elements, 608,256 bits of embedded memory, and 156 available I/O. The 472.5 MHz maximum operating frequency supports moderately high-speed digital logic, while the 256-ball package provides a compact surface-mount option for space-constrained boards. The commercial temperature range is 0°C to +85°C, and the JLCPCB listing identifies the device as RoHS compliant. The device supports 24,624 CLBs according to the distributor data and provides 608,256 bits of configuration memory. Its I/O count and package arrangement determine how many external signals can be routed between the FPGA and surrounding circuitry. Because a BGA package uses solder balls beneath the component, assembly requires appropriate board design, inspection, and thermal-management practices rather than conventional through-hole or leaded-solder handling. Typical uses include industrial automation, networking equipment, embedded control, video or image-processing pipelines, and digital interface consolidation. The 472.5 MHz operating frequency is appropriate for parallel datapaths, protocol bridging, control logic, and general-purpose programmable signal processing. The 156 I/O provide substantial connectivity for external memory, converters, transceivers, and control peripherals, subject to the device's bank-specific power and interface constraints. Designers should verify the exact pinout, supported I/O standards, configuration scheme, power-supply sequencing, and exposed-pad requirements against the manufacturer datasheet before layout. The BGA land pattern and ball assignments must be copied exactly, while power and ground distribution should minimize loop area and provide appropriate decoupling. Configuration storage and programming-device compatibility should also be validated early in the hardware schedule. This product record combines distributor specifications, package data, lifecycle observations, sourcing links, and explicit drop-in alternatives. It also distinguishes commercial, speed-grade, and industrial-temperature variants, providing engineering context that helps reduce the risk of selecting an electrically similar but mechanically unsuitable substitute.
EP3C25U256I7 - 24624-Lcell Cyclone III FPGA | Altera
Altera EP3C25U256I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 156 user I/Os, a 437.5 MHz maximum operating frequency, and a 256-ball LFBGA package. The industrial-temperature device operates from a 1.2 V core supply and is manufactured on a 65 nm CMOS process. Its combination of programmable logic, embedded memory resources, and a 256-ball surface-mount package supports compact control, interface, signal-processing, and embedded-processing systems. A field-programmable gate array, or FPGA, is a programmable digital logic device whose interconnect and logic configuration can be loaded after manufacture. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic family of FPGA and CPLD devices. The Cyclone III family targets designs requiring more logic capacity than small CPLDs while maintaining a broad selection of embedded memory, general-purpose I/O, and dedicated resources for communications, control, and signal processing. The EP3C25U256I7 provides 24,624 logic elements, 156 user I/Os, and 608,256 configuration bits. Its listed maximum frequency is 437.5 MHz, although realized system performance depends on the selected logic architecture, memory interface, clocking scheme, I/O standard, timing constraints, and design utilization. The 1.2 V core voltage and 65 nm process place the device in a low-voltage, high-density programmable-logic class designed for efficient integration of digital control functions. The 256-LFBGA package provides a high ball-count interconnect suitable for boards requiring substantial I/O access. Unlike a leaded package, the LFBGA requires careful escape routing, short return paths, controlled reference planes, and assembly-process controls for thermal and electrical performance. Industrial-temperature grading makes the device relevant to equipment that must operate beyond commercial-temperature environments, but the exact minimum and maximum junction or ambient ratings must be taken from the manufacturer documentation before a production release. Typical applications include industrial automation, communications equipment, embedded control, test and measurement, and compact signal-processing modules. In these systems, the FPGA can implement parallel control logic, hardware state machines, interface bridges, protocol endpoints, and fixed-function datapaths that would otherwise require multiple programmable devices. Configuration storage, clock generation, power sequencing, and I/O voltage planning remain important parts of the surrounding circuit. A key design consideration is that the advertised 437.5 MHz figure should not be treated as a guaranteed system clock for every design. Timing closure depends on the selected speed grade and logic path. Engineers should use the Quartus design tools and the Cyclone III device documentation to obtain pin assignments, timing results, power estimates, and configuration requirements before releasing PCB source files. This product record combines the exact EP3C25U256I7 identifiers, package and architecture details, commercially focused buying guidance, replacement analysis, and practical implementation notes. It also distinguishes the verified drop-in option from family members that use different packages, helping engineers distinguish true PCB reuse from designs that require hardware changes.
EP3C40F324C7N - Cyclone III FPGA, 39.6K LE, 324-FBGA | Intel
The Intel (formerly Altera) EP3C40F324C7N is a Cyclone III Field-Programmable Gate Array (FPGA) from the low-power, low-cost Cyclone III family built on a 65 nm TSMC process. The device integrates 39,600 logic elements (LEs), 1,161,216 bits of embedded memory (1161 Kb / 141.25 Kbytes per the FPGAkey listing), 195 user I/O pins, and 4 PLLs in a 324-pin FineLine BGA (FBGA) package with a 1.2 V core supply. The C7 speed grade targets commercial 0 to 85 °C operation at 437.5 MHz internal performance. A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based fabric, distributed and block RAM (M9K/M144K), DSP blocks, and PLL clock management in a single chip. In the broader taxonomy it sits under programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA -> semiconductor. The Cyclone III family introduced hard 3.125 Gbps transceivers-free design with significantly lower static and dynamic power than Cyclone II, making it a common choice for cost-sensitive, high-volume designs. Key differentiating features of the EP3C40F324C7N include 4 phase-locked loops for flexible clock synthesis, embedded multiplier blocks for moderate DSP workloads, support for external memory interfaces such as DDR/DDR2 SDRAM, QDRII SRAM, and single data-rate SRAM through dedicated DQS pins, and a MultiTrack interconnect optimized for high-utilization designs. The device supports serial configuration via EPCS or EPCQ devices as well as JTAG (IEEE 1149.1) and parallel passive/active configuration. Architecturally, the EP3C40F324C7N employs logic-array-block (LAB) tiles of 16 LEs each, with carry chains and register chains spanning LABs for efficient arithmetic. Logic is paired with M9K (9 Kbit) block RAM blocks and dedicated 18x18 hardware multipliers, giving designers a balanced fabric for control logic, FIFOs, and signal processing. Configuration data is stored in SRAM; an external configuration device (EPCS4/EPCS16/EPCQ16, etc.) or JTAG programmer loads the bitstream at power-up. Typical applications include industrial motor control, video surveillance and image processing pipelines, low-cost software-defined radio (SDR) front-end glue logic, telecom baseband glue logic and protocol bridging, prototyping of ASIC designs, and consumer display controllers. The 324-FBGA package's compact footprint suits space-constrained boards while retaining enough I/O for parallel external memory buses and high-speed LVDS pairs. When designing, treat the 1.2 V core and 2.5 V/3.3 V I/O rails as separate supply domains and decouple each with 0.1 µF and 10 µF capacitors near the balls. Configure PLL loop-bandwidth settings per the datasheet for jitter-sensitive applications, and verify FPGA timing with TimeQuest (Quartus Prime) against the chosen speed grade. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical PCB/power design notes not consolidated in any single manufacturer document.
EP3C40F324C8 - 39600-Cell Cyclone III FPGA | Intel
The Intel EP3C40F324C8 is a Cyclone III field-programmable gate array with 39,600 logic elements, a maximum stated operating frequency of 402 MHz, and a 1.2 V core supply in a 324-ball FBGA package. The device provides 195 I/O positions according to the manufacturer product listing, making it suitable for compact embedded systems that require substantial programmable logic, parallel interfaces, memory interfaces, and deterministic control functions within a single integrated circuit. An FPGA is a programmable semiconductor whose internal logic, interconnects, and input/output blocks are configured after manufacture. The FPGA and CPLD are branches of programmable logic devices, while the broader hierarchy includes digital logic ICs and semiconductors. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured for protocol bridging, signal processing, test instrumentation, communications, and embedded control applications. The EP3C40F324C8 belongs to Intel's Cyclone III device family. Its headline resource count is 39,600 logic elements, while the 402 MHz frequency represents the maximum operating frequency associated with the device listing rather than the performance of every embedded design. A 1.2 V core supply reduces the number of core rails commonly required by FPGA designs, although external interfaces still require correctly specified board-level power rails and termination. The 324-BGA package supports dense PCB integration and high I/O availability, but it also demands careful escape routing, via planning, thermal design, and assembly-process control. The listing identifies 195 I/O positions, package terminals as balls, and a square package form. Exact power, memory, I/O-standard, timing, and differential-capability details must be confirmed in the Cyclone III device documentation before schematic or PCB sign-off. Typical uses for this device include industrial data acquisition, parallel sensor and actuator interfaces, communications infrastructure, test and measurement systems, embedded signal processing, and general-purpose programmable control. Its 39,600 logic elements provide substantially more parallel hardware capability than a small microcontroller while retaining the flexibility of programmable logic. The 402 MHz device rate also makes time-domain logic and tightly pipelined interface functions practical. When laying out a board around the EP3C40F324C8, prioritize power-plane integrity, decoupling placement, clock routing, and BGA escape routing. Confirm the exact pinout and pin assignment in the manufacturer device documentation before assigning ball locations. Avoid treating the package ball count as the number of usable user I/O, because dedicated power, ground, configuration, clock, and reserved balls may be present. This product page consolidates the core device identity, package information, sourcing details, comparison criteria, and practical integration guidance into one engineering reference. It is intended to support initial design selection and procurement planning, while final timing, power, and compatibility decisions remain tied to the official Cyclone III documentation and the selected system design.
EP3C40F324C8N - 39.6K LE Cyclone III FPGA, 324-FBGA | Intel
The Intel (formerly Altera) EP3C40F324C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory (approximately 1.16 Mbit), and 126 embedded 18x18 multipliers, housed in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a low-power 60 nm process and operates from a 1.2 V core supply with a maximum core clock frequency of 402 MHz in the speed grade 8 commercial temperature part. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic circuits through a configuration bitstream stored in SRAM. FPGAs sit in the broader taxonomy of programmable logic device -> programmable logic IC -> semiconductor. They are widely used to implement glue logic, high-speed parallel DSP, custom bus interfaces, and hardware-accelerated functions that would otherwise require multiple discrete logic ICs or an ASIC. The Cyclone III family specifically targets cost-sensitive, low-power applications that still need the parallel processing and DSP density of an FPGA. Key features of the EP3C40F324C8N include up to 215 user I/O pins (the 324-FBGA variant exposes the largest I/O count in the EP3C40 group), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. Each logic element (LE) contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic. Configuration is volatile (SRAM-based) so the bitstream must be reloaded from a flash or microcontroller on every power-up. Architecturally, the Cyclone III device uses a 60 nm TSMC low-power process with a 1.2 V core. The Logic Array Block (LAB) is composed of 16 LEs, and columns of embedded memory and DSP blocks are interleaved across the fabric to provide local high-bandwidth connectivity. The four PLLs support programmable frequency synthesis, phase shifting, and spread-spectrum clocking. This combination enables the EP3C40 to drive high-throughput parallel DSP pipelines, video processing, and protocol bridging at low static and dynamic power. Typical applications for the EP3C40F324C8N include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver-assistance prototypes, telecommunications line-card glue logic, low-cost software-defined radio front ends, and portable medical instrumentation. The 324-FBGA package makes the device suitable for board designs where maximum I/O count is required but a fine-pitch BGA assembly process is acceptable. When designing with this part, note that the 1.2 V core and the PLL analog supply both require decoupling - place 0.1 uF and 10 uF capacitors close to each supply pin and use a power-plane cutout beneath the BGA to control return-current paths. The BGA also requires a multi-layer PCB with microvia or via-in-pad technology to reliably route all 324 balls. Finally, because the configuration memory is SRAM-based, a boot source (EPCS flash, parallel flash, or microcontroller) must be present at every power-up. This page synthesizes distributor pricing, drop-in alternatives across the Cyclone III EP3C family, and practical design notes not found in the manufacturer datasheet alone, giving a single reference for sourcing and engineering the EP3C40F324C8N.