10AX090N2F45I2SG vs 10AX090N2F45E2LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090N2F45I2SG sa pamamagitan ng Intel at 10AX090N2F45E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10AX090N2F45I2SG 10AX090N2F45E2LG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Product Type FPGA (Field Programmable Gate Array) —
Family Arria 10 GX Arria 10 GX
Logic Elements 900,000 900,000
Embedded Memory (Bits) 59,234,104 —
User I/Os 768 —
Number of LABs/CLBs 33750 —
Process Technology 20 nm 20 nm
Core Voltage 0.9 V 0.9 V
Temperature na Operasyon -40C to +100C (Industrial) —
Packhaging 1932-BBGA, F45 (FCBGA flip-chip) 1932-ball FCBGA (FBGA)
Uri ng Pagpapasok Surface Mount Surface Mount
Speed Grade -2 —
Configuration Method JTAG / Serial / Parallel flash —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
GTX/Transceivers [DATA_NEEDED: transceiver count per device variant] —
Tindminan RoHS Compliant —
Lead-Free Yes —
Level ng MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Embedded Memory (bits) — 59,234,304
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
User I/O Pins — 768
Transceivers — [DATA_NEEDED: transceiver count and data rate]
DSP Blocks — [DATA_NEEDED: DSP block count]
PLLs — [DATA_NEEDED: PLL count]
Package Type — Flip-Chip BGA, surface mount
Operating Temperature Grade — Enhanced (E2)
Lead-Free / RoHS — Yes (per part suffix LG)
Configuration Memory — SRAM-based, volatile (external flash required)
Katayuan ng Lifecycle — Active

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