10AX090R3F40E2SG vs 10AX115R3F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R3F40E2SG sa pamamagitan ng Intel at 10AX115R3F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R3F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Logic Array Blocks (LABs) | 339,620 | — |
| Embedded Memory (Bits) | 59,234,304 | — |
| DSP Blocks | 2,713 (18x19 multipliers) | 1,518 (variable-precision, hard FP) |
| User I/O | 342 | — |
| Process Technology | 20 nm | TSMC 20 nm |
| Core Voltage | 0.85 V | — |
| Auxiliary Voltage | 0.9 V | — |
| Speed Grade | -E2 (extended, mid-tier) | -2 |
| Temperature Grade | Extended (-40C to +100C) | E2 (0C to +100C) |
| Packhaging | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |