10AX090S2F45E2LG vs 10AX090R2F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090S2F45E2LG sa pamamagitan ng Intel at 10AX090R2F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090S2F45E2LG | 10AX090R2F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900000 |
| Embedded Memory (bits) | 59,234,304 | — |
| DSP Blocks | Variable-precision, 24-bit multiplier base | Variable-precision, hardened floating-point capable |
| Adaptive Logic Modules (ALMs) | 338,200 | — |
| Transceiver Channels | Up to 24 (data rate per channel up to 14.1 Gbps) | — |
| Hard Memory Controllers | 4, supports DDR4 / DDR3 / RLDRAM3 / QDR IV | — |
| PCIe Hard IP | PCI Express Gen3 x8 / Gen2 x8 | — |
| Process Technology | 20 nm Tri-Gate (FinFET) | — |
| Speed Grade | E2 (commercial/extended) | 2 (R2 -2 transceiver rating) |
| Packhaging | 1932-ball FCBGA, 45 mm body (F45) | — |
| Operating Temperature Grade | Industrial (per -LG suffix convention; verify against order code) | — |
| Core Voltage (Vcc) | 0.9 V (nominal; per family datasheet) | — |
| User I/O Banks | [DATA_NEEDED: total user I/O count for 10AX090S2F45E2LG] | — |
| RoHS / Lead-Free | Yes (LG suffix indicates Pb-free) | — |
| Configuration Interface | Active serial (EPCQ-L), JTAG, Fast Passive Parallel | — |
| LABs/CLBs | — | 339620 |
| Total RAM Bits | — | 59234304 |
| User I/O Count | — | 342 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Code | — | F40 (approx. 40mm FCBGA) |
| Temperature Grade | — | E2 (Extended: -40C to +100C junction) |
| Lead-Free / RoHS | — | Yes (SG suffix) |
| Transceivers | — | Up to 14.1 Gbps (Arria 10 GX feature) |
| Process Node | — | TSMC 20nm |
| Uri ng Pagpapasok | — | Surface Mount (FCBGA ball grid) |
| Level ng MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |