10AX115H3F34E2LG vs 10AX115H2F34E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115H3F34E2LG sa pamamagitan ng Intel at 10AX115H2F34E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115H3F34E2LG - Arria 10 GX FPGA, 1.15M LE, 1152-FCBGA | Intel
10AX115H3F34E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115H3F34E2LG | 10AX115H2F34E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | — |
| Series | 10AX115 | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | — |
| User I/O Count | 504 | — |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | 24 channels up to 14.1 Gbps |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | Hardened IEEE 754 single/double-precision floating-point |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | E2 (commercial, mid-speed) | — |
| Packhaging | 1152-ball FCBGA (F34), 1.0 mm pitch | 1152-ball FCBGA (F34) 35x35 mm |
| Temperature na Operasyon | 0C to +100C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA, reflow) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory (M20K blocks) | — | 2,713 blocks / 68,857,600 bits |
| User I/O Pins | — | 504 |
| PCIe Hard IP | — | Gen3 x4 / Gen2 x8 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| 18x19 Multipliers | — | 2,150 |
| PLLs | — | Fractional, up to 24 |
| Memory Interfaces | — | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 |
| Speed/Operating Temperature Grade | — | -2 / 0 C to 100 C (E2 = industrial, enhanced) |
| Process Node | — | 20 nm Tri-Gate (Intel) |