10AX115H3F34E2LG vs 10AX115H2F34E2SG 比較
詳細並排比較 10AX115H3F34E2LG 由 Intel 與 10AX115H2F34E2SG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10AX115H3F34E2LG | 10AX115H2F34E2SG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria 10 GX | — |
| Series | 10AX115 | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | — |
| User I/O Count | 504 | — |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | 24 channels up to 14.1 Gbps |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | Hardened IEEE 754 single/double-precision floating-point |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | E2 (commercial, mid-speed) | — |
| 封裝 | 1152-ball FCBGA (F34), 1.0 mm pitch | 1152-ball FCBGA (F34) 35x35 mm |
| 工作溫度 | 0C to +100C (commercial) | — |
| 安裝類型 | Surface Mount (BGA, reflow) | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| MSL 等級 | MSL3 (per JEDEC J-STD-020) | — |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory (M20K blocks) | — | 2,713 blocks / 68,857,600 bits |
| User I/O Pins | — | 504 |
| PCIe Hard IP | — | Gen3 x4 / Gen2 x8 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| 18x19 Multipliers | — | 2,150 |
| PLLs | — | Fractional, up to 24 |
| Memory Interfaces | — | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 |
| Speed/Operating Temperature Grade | — | -2 / 0 C to 100 C (E2 = industrial, enhanced) |
| Process Node | — | 20 nm Tri-Gate (Intel) |