10AX115N2F40E1SG vs 10AX115N3F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N2F40E1SG sa pamamagitan ng Intel at 10AX115N3F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115N2F40E1SG | 10AX115N3F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,600 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Variable-precision DSP |
| Maximum User I/O Pins | 600 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | 600 |
| Maximum Transceiver Data Rate | 17.4 Gbps (chip-to-chip) | 17.4 Gbps |
| Hard PCIe IP Blocks | PCIe Gen3 | — |
| Process Technology | 20 nm | TSMC 20 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA (F40) |
| Package Dimensions | 40 mm x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | N2 | — |
| Temperature Grade | E1 (commercial) | — |
| Temperature ng Junction na Operasyon | -40C to +100C | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory | — | 68,857,856 bits (approximately 68.85 Mbit) |
| Hard Memory Controllers | — | Yes (DDR4 support) |
| PCIe Hard IP | — | PCIe Gen3 (hard IP) |
| Package Code | — | BGA / FCBGA |
| Operating Temperature Grade | — | E2 (Enhanced, -40C to +100C) |
| Configuration Memory Technology | — | SRAM-based (volatile, requires external boot flash) |
| Recommended Toolchain | — | Intel Quartus Prime |