10AX115N2F40I2SG vs 10AX115N2F40E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N2F40I2SG sa pamamagitan ng Intel at 10AX115N2F40E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115N2F40I2SG - Arria 10 GX FPGA, 1.15M LEs, 1517-FCBGA | Intel
10AX115N2F40I2SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115N2F40I2SG | 10AX115N2F40E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory Bits | 68,857,856 | 68,857,600 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | [DATA_NEEDED: transceiver count] |
| DSP Blocks | Variable-precision, hard floating-point | [DATA_NEEDED: DSP block count] |
| Packhaging | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-BBGA, FCBGA (F40) |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Speed Grade | 2 | N2 |
| Process Technology | TSMC 20 nm | 20 nm |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| Maximum User I/O Pins | — | 600 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (chip-to-chip) |
| Hard PCIe IP Blocks | — | PCIe Gen3 |
| Core Voltage | — | 0.9 V |
| Package Dimensions | — | 40 mm x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | E1 (commercial) |
| Temperature ng Junction na Operasyon | — | -40C to +100C |