10AX115N3F45E2SG vs 10AX115U3F45E2SG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N3F45E2SG sa pamamagitan ng Intel at 10AX115U3F45E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10AX115N3F45E2SG 10AX115U3F45E2SG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria 10 GX Arria 10 GX
Logic Elements 1,150,000 —
Embedded Memory 68,857,856 bits —
User I/Os 768 —
Packhaging 1932-ball FCBGA (45 x 45 mm, 1.0 mm pitch) 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch)
Process Technology 20 nm TSMC —
Speed Grade -2 (middle) -2 (E2 commercial/extended)
Temperature Grade E2 (extended) —
Transceivers Up to 24 channels, 12.5 Gbps GX —
DSP Blocks Variable-precision, 27 x 27 multipliers Variable-precision, hardened floating-point
Hard Memory Controllers Yes (DDR3/DDR4/LPDDR3) 2 (DDR4/DDR3/QDRII+/RLDRAM3)
Hard PCIe IP PCIe Gen3 x8 (hard IP) —
Hard Processor System Not included (FPGA-only variant) —
Tindminan RoHS Compliant —
Uri ng Pagpapasok Surface Mount (SMT) —
Logic Elements (LE) — 1,150,000
Adaptive Logic Modules (ALM) — 427,200
Embedded Memory Bits — 68,857,856 (≈ 52.99 Mbit)
Number of Transceivers — [DATA_NEEDED: per-die transceiver count, F45 package variant]
Maximum Transceiver Data Rate — 17.4 Gbps
Hard PCIe Gen3 IP Blocks — 2 × PCIe Gen3 (x8/x4/x2/x1)
Process Node — 20 nm Tri-Gate (Intel)
Temperature na Operasyon — Industrial (junction -40 °C to +100 °C) – device grade U
Supply Voltage Core — [DATA_NEEDED: VCC/VCCP core voltage]
Configuration Method — FPGA configuration via serial/parallel flash, JTAG
RoHS Compliance — Compliant
Level ng MSL — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]

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