10AX115U3F45E2SG vs 10AX115U2F45E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115U3F45E2SG sa pamamagitan ng Intel at 10AX115U2F45E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115U2F45E2SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
10AX115U2F45E2SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115U3F45E2SG | 10AX115U2F45E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory Bits | 68,857,856 (≈ 52.99 Mbit) | 68,857,560 |
| Number of Transceivers | [DATA_NEEDED: per-die transceiver count, F45 package variant] | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, hardened floating-point | 1,518 (variable-precision, hardened FP) |
| Hard Memory Controllers | 2 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| Hard PCIe Gen3 IP Blocks | 2 × PCIe Gen3 (x8/x4/x2/x1) | — |
| Packhaging | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) | 1932-ball FCBGA (45 mm) |
| Process Node | 20 nm Tri-Gate (Intel) | 20 nm |
| Speed Grade | -2 (E2 commercial/extended) | 2 |
| Temperature na Operasyon | Industrial (junction -40 °C to +100 °C) – device grade U | — |
| Supply Voltage Core | [DATA_NEEDED: VCC/VCCP core voltage] | — |
| Configuration Method | FPGA configuration via serial/parallel flash, JTAG | — |
| RoHS Compliance | Compliant | — |
| Level ng MSL | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Blocks | — | 2,134 M20K blocks (approx.) |
| User I/Os | — | 480 |
| Transceivers | — | Up to 24 (GX, 12.5 Gbps) |
| PCIe Hard IP | — | Gen3 x8 |
| Memory Interfaces | — | DDR4, QDR-IV, RLDRAM3 |
| Temperature Grade | — | E2 (industrial) |
| Uri ng Pagpapasok | — | Surface Mount |
| Tindminan RoHS | — | Compliant |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |