10CL010ZM164I8G vs 10CL010YM164C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10CL010ZM164I8G sa pamamagitan ng Intel at 10CL010YM164C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10CL010ZM164I8G | 10CL010YM164C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kbits) | 414 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 46 | 56 |
| Maximum User I/O | 101 | — |
| Packhaging | 164-ball MBGA (FineLine BGA, M164) | 164-ball MBGA (Micro BGA, 8x8 mm) |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage | 1.0 V (typical), 1.2 V I/O banks | 1.0 V nominal (range 1.0 V to 1.1 V) |
| Configuration Modes | PS, FPP, JTAG | — |
| PLLs | 4 (per device, exact count [DATA_NEEDED: PLL count]) | 4 |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| External Memory Support | DDR2, DDR3, LPDDR2 (via soft IP) | — |
| Tindminan RoHS | Compliant | Compliant |
| Packaging | Tray (I8G suffix) | — |
| Maximum User I/Os | — | 224 |
| Process Node | — | TSMC 60 nm low-power |
| Speed Grade | — | -8C (commercial, 8 speed grade) |
| Temperature ng Junction na Operasyon | — | 0 C to +85 C (commercial) |
| Configuration Method | — | SRAM-based, JTAG/AS/AP/PS |
| Transceivers | — | None (general-purpose FPGA, no high-speed SERDES) |
| Hard PCIe Controller | — | 1x PCIe Gen1 (x1/x2 root port or endpoint) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes |