10M08DAF256C7G vs 10M04DAF256C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DAF256C7G sa pamamagitan ng Intel at 10M04DAF256C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DAF256C7G | 10M04DAF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 | 4,000 |
| Embedded Memory (M9K blocks) | 46 (378 Kbits) | — |
| User Flash Memory | 387,072 bits (approx. 48 KB) | 193,536 bits |
| Maximum User I/O | 178 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | 0 °C to +85 °C (Commercial, "C" grade) | — |
| Packhaging | 256-pin LBGA (F256) | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm |
| Package Dimensions | 17 mm × 17 mm, 1.0 mm ball pitch | — |
| On-chip ADC | 12-bit, 1 MSPS, 1 channel | — |
| PLLs | 2 | — |
| 18 × 18 Multipliers | 24 | — |
| Configuration | Dual-configuration internal flash (D-series) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (Pb-free "G" suffix) | Compliant |
| Process Technology | [DATA_NEEDED: process node, typically 55 nm embedded flash] | 55 nm TSMC flash-based |
| Internal Oscillator | Yes (on-chip) | — |
| Maximum User I/Os | — | 178 |
| Embedded Memory (M9K blocks total) | — | 176 Kbits |
| Configuration Flash (on-die) | — | 1,178 Kbits (CFM0 + CFM1 dual-config) |
| Temperature Grade (junction) | — | 0C to 100C (commercial) |
| Auxiliary Voltage | — | 2.5 V / 3.3 V |
| ADC | — | 1 x 12-bit, 1 Msps SAR |
| PLL | — | 1 (general-purpose) |
| LVDS Transmitter (max data rate) | — | 800 Mbps |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | Yes |