10M08DAU324I7G vs 10M08DAF484I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08DAU324I7G sa pamamagitan ng Intel at 10M08DAF484I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08DAU324I7G | 10M08DAF484I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | 8000 |
| Embedded Memory (M9K blocks) | 378 Kbits | — |
| User Flash Memory | 387,072 bits | — |
| Maximum User I/O | 246 | — |
| Packhaging | 324-LFBGA (UBGA), 1.0 mm pitch | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40 °C to +100 °C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm |
| DSP Blocks (18x18 Multipliers) | 24 | — |
| PLLs | 4 | — |
| On-chip ADC | Dual 12-bit, 1 MSPS | — |
| Configuration | Internal flash, JTAG, Passive Serial | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | — |
| Family | — | MAX 10 FPGA |
| Embedded Memory (bits) | — | 387072 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Supply Voltage - Core | — | 1.2 V |
| Packhaging / Kaso | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Lead Free | — | Yes |
| Configuration Memory | — | Internal flash (non-volatile) |