10M25DCF256I7G vs 10M08DCF256I7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DCF256I7G sa pamamagitan ng Intel at 10M08DCF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
10M25DCF256I7G 10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel

10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel

10M25DCF256I7G ✓ Nakahanda
Intel
10M08DCF256I7G 10M08DCF256I7G - MAX 10 FPGA, 8K LE, 256-FBGA | Intel

10M08DCF256I7G - MAX 10 FPGA, 8K LE, 256-FBGA | Intel

10M08DCF256I7G ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro 10M25DCF256I7G 10M08DCF256I7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series MAX 10 MAX 10
Logic Elements (LE) 25,000 8,000
Number of LABs/CLBs 1,563 —
Total RAM Bits 691,200 (675 Kbit) —
Number of I/O Pins 178 —
Packhaging / Kaso 256-LBGA (F256, 17x17 mm, 1.0 mm pitch) —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon -40C to +100C (Industrial) -40C to +100C (Industrial)
Speed Grade I7 (fastest industrial speed grade) —
Configuration Memory On-chip flash (non-volatile, instant-on) On-chip dual-configuration flash (non-volatile)
User Flash Memory [DATA_NEEDED: user flash size in Mbit] —
Embedded ADC 12-bit, multi-channel (per MAX 10 family) —
PLLs [DATA_NEEDED: PLL count per F256 variant] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Programming Method JTAG / Passive Serial (via Quartus Prime) —
Level ng MSL 3 (per BGA handling) —
Tindminan RoHS Compliant Compliant
Lead-Free / Halogen-Free Yes —
Packaging Tray —
Family — MAX 10 FPGA
Embedded Memory (bits) — 387,072
User I/O Count — 178
DSP Blocks (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Packhaging — 256-FBGA (FineLine BGA)
Supply Voltage - Core — [DATA_NEEDED: core voltage range]
Supply Voltage - I/O Banks — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
On-die ADC — 12-bit, up to 1 MSa/s
External Memory Interface — LPDDR2 / DDR3 / DDR3L
Lead-Free — Yes
Process Technology — 55 nm NOR-flash-backed CMOS

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