10M50DAF256C8G vs 10M50DAF256I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF256C8G sa pamamagitan ng Intel at 10M50DAF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DAF256C8G | 10M50DAF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | On-chip (4 typical for 10M50 family) |
| Global Clock Networks | 20 | — |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Packhaging | 256-ball FBGA (F256) | 256-LBGA (17 mm x 17 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |
| Configuration Mode | — | Internal flash (instant-on) |