10M50DAF256C8G vs 10M50DCF256C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF256C8G sa pamamagitan ng Intel at 10M50DCF256C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DAF256C8G | 10M50DCF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | 20 |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | 55 nm TSMC |
| Core Voltage | 1.2 V | — |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | -7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to 85C) |
| Packhaging | 256-ball FBGA (F256) | 256-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Level ng MSL | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50000 |
| Maximum User I/O | — | 178 |
| User Flash Memory | — | 1,677,312 bits (1677 Kb) |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Configuration Memory | — | Internal dual-configuration flash (non-volatile) |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |