10M50DAF256I7G vs 10M50DCF256C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF256I7G sa pamamagitan ng Intel at 10M50DCF256C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DAF256I7G | 10M50DCF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | 178 |
| Packhaging | 256-LBGA (17 mm x 17 mm) | 256-ball FBGA (FineLine BGA) |
| Configuration Memory | Internal non-volatile flash (dual-boot) | Internal dual-configuration flash (non-volatile) |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| PLLs | On-chip (4 typical for 10M50 family) | 2 |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm TSMC |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| Tindminan RoHS | Compliant | — |
| Configuration Mode | Internal flash (instant-on) | — |
| User Flash Memory | — | 1,677,312 bits (1677 Kb) |
| User SRAM | — | 1638 Kbits |
| Embedded Multipliers (18x18) | — | 16 |
| Global Clock Networks | — | 20 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature Grade | — | Commercial (0C to 85C) |
| Speed Grade | — | -7 |
| ADC | — | 12-bit, 1 MSPS, 17 channels (hard IP) |