10M50DCF256A7G vs 10M50DAF256I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DCF256A7G sa pamamagitan ng Intel at 10M50DAF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DCF256A7G | 10M50DAF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| User Flash Memory | 1,677,312 bits | — |
| User I/O Count | 178 | — |
| Packhaging | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-LBGA (17 mm x 17 mm) |
| Process Node | 55 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Temperature na Operasyon | -40 C to +85 C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) | — |
| Embedded Memory | M9K blocks, 9 Kbits each | — |
| Embedded Multipliers | 144 x 18 x 18 | — |
| PLL | 4 | — |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels | — |
| Configuration | Internal flash (single-chip, instant-on) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |
| PLLs | — | On-chip (4 typical for 10M50 family) |
| Process Technology | — | TSMC 55 nm embedded flash |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |
| Configuration Mode | — | Internal flash (instant-on) |