5CGXBC9E7F31C8N vs 5CGXBC9E6F31C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC9E7F31C8N sa pamamagitan ng Intel at 5CGXBC9E6F31C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXBC9E7F31C8N | 5CGXBC9E6F31C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | Cyclone V GX |
| Logic Elements | 301,000 | 301,000 |
| Adaptive Logic Modules (ALMs) | 113,560 | 113,560 |
| Embedded Memory Bits | 14,251,008 (approx. 13.6 Mbit) | — |
| DSP Blocks (18x18) | 480 | 342 |
| Maximum User I/O Pins | 480 | — |
| Transceivers | 6 channels up to 3.125 Gbps | 12 (3.125 Gbps) |
| Transceiver Protocols | PCIe Gen2, CPRI, OBSAI, GbE, SDI | — |
| Hard PCIe Controllers | 2 (x4/x4 or x8) | — |
| PLLs | 4 | 6 |
| Global Clock Networks | 16 | 12 |
| Hard Memory Controller | DDR2/DDR3/LPDDR2 (soft IP) | — |
| Process Technology | TSMC 28nm low-power | — |
| Core Voltage | 1.1 V | — |
| Packhaging | 896-pin FBGA (F31), 1.0 mm pitch | 896-pin FBGA (F31) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Configuration Mode | AS, PS, FPP, CvP (PCIe) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory | — | 14,251,008 bits |
| Embedded Memory Blocks (M9K) | — | 1,720 |
| Maximum User I/O | — | 480 |
| PCIe Hard IP Blocks | — | 2 (Gen2 x1, x2, x4) |
| Process Node | — | 28 nm TSMC |
| Core Supply Voltage (VCCINT) | — | 1.1 V |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Package Dimensions | — | 31 mm x 31 mm |