5CSEBA2U23A7N vs 5CSEBA4U19A7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA2U23A7N sa pamamagitan ng Intel at 5CSEBA4U19A7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CSEBA2U23A7N | 5CSEBA4U19A7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| MPN Code | 5CSEBA2U23A7N (Cyclone V SE A2, U23 package) | — |
| Logic Elements | 25,000 LE | 40 K |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 700 MHz | — |
| Process Technology | 28 nm low-power | — |
| User I/O | 188 | 161 |
| Packhaging | 672-UBGA (23x23 mm) | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Speed Grade | 7 | — |
| Temperature Grade | A (Commercial, 0C to +85C) [DATA_NEEDED: exact junction range] | — |
| Tindminan RoHS | Compliant (per ampheo listing) | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Operating Voltage (Core) | 1.1 V (typical FPGA core, multi-rail HPS) | — |
| Configuration Scheme | HPS-boot of FPGA fabric via configuration QSPI | — |
| Embedded Memory | M10K blocks (count [DATA_NEEDED: exact M10K/M20K count]) | 3.4 Mbits (M9K) |
| DSP Blocks | Variable-precision DSP (count [DATA_NEEDED: exact count]) | — |
| PLLs | Fractional PLLs (count [DATA_NEEDED: exact PLL count]) | [DATA_NEEDED: PLL count] |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Adaptive Logic Modules | — | [DATA_NEEDED: ALM count] |
| DSP Blocks (18x18 Multipliers) | — | 224 |
| HPS Maximum Application Clock | — | 925 MHz |
| Memory Interfaces | — | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| Temperature ng Junction na Operasyon | — | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Core Voltage | — | 1.1 V (typical) |