5CSEBA4U19A7N - Cyclone V SE SoC FPGA, 40K LE, 484-UBGA | Intel
MPN: 5CSEBA4U19A7N ✓ Nakahanda5CSEBA4U19A7N Ulas
A System-on-Chip FPGA is a heterogeneous compute device that combines a hard-application processor subsystem (HPS) with a programmable logic fabric on a single silicon die, enabling deterministic hardware acceleration alongside rich software stacks. The HPS-to-FPGA bridges (AXI-32, AXI-64, AXI-128) allow latency-critical control loops to be offloaded to custom logic while the Cortex-A9 cores run Linux or RTOS workloads, eliminating the need for a discrete host processor and reducing board area, BOM cost, and inter-chip latency.
Key features include approximately 40K logic elements, 224 18x18 multipliers, 3.4 Mbits of embedded memory, dual ARM Cortex-A9 MPCore at up to 925 MHz (speed-grade dependent), hard DDR3 controller with ECC, integrated PLL and clock tree, and a single 3.0 V core power rail. The SE variant is optimized for lowest static power while keeping transceiver logic available.
The fabric uses a TSMC 28 nm low-power process with adaptive logic modules (ALMs), 8-input fracturable look-up tables, and variable-precision DSP blocks. Embedded memory blocks (M9K) operate up to 274 MHz and can be configured as single-port, dual-port, or FIFO with byte-enable support for efficient buffer management.
Typical applications include industrial motor control, factory automation HMIs, machine vision edge nodes, automotive driver assistance, medical imaging preprocessing, and ruggedized military communications. The combination of an ARM host processor with programmable logic makes the device especially attractive for smart-camera and sensor-fusion appliances that require both deterministic hardware pipelines and a Linux software stack.
When designing with this device, follow Intel's PowerPlay early power estimation workflow before PCB layout: the FPGA and HPS each require independent decoupling schemes, and the 484-UBGA package demands 1.0 mm pitch fan-out with microvia stack-ups on at least 6 PCB layers.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on individual distributor listings, giving engineers a single decision-ready view of the 5CSEBA4U19A7N for SoC FPGA selection and second-source planning.
Mga alternatibo na pwedeng ilagay na 5CSEBA4U19A7N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok 5CSEBA4U19A7N (parehas na form factor at footprint) — pagkakaiba sa Package, Logic Elements, Operating Temperature, Process Technology, DSP Blocks.
5CSEBA5U19A7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →5CSEBA2U19A7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →5CSEBA2U23A7N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →5CGTFD9A5U19A7N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →5CSEBA4U19A7N Mga Pinakamataas na Rating at Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 40 K |
| Embedded Memory | 3.4 Mbits (M9K) |
| DSP Blocks (18x18 Multipliers) | 224 |
| HPS Maximum Application Clock | 925 MHz |
| Memory Interfaces | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| User I/O | 161 |
| Packhaging | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount (BGA) |
| Temperature ng Junction na Operasyon | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | TSMC 28 nm low-power |
| Core Voltage | 1.1 V (typical) |
| Tindminan RoHS | Compliant |
| Level ng MSL | 3 (168 hours) |
Gabay sa Pin Configuration ng 5CSEBA4U19A7N 484-ubga (u19), 19x19 mm, 1.0 mm pitch
Pin configuration para sa 5CSEBA4U19A7N (484-ubga (u19), 19x19 mm, 1.0 mm pitch package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa 5CSEBA4U19A7N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
5CSEBA4U19A7N ay nararapat para sa 6 aplikasyons: Industrial Motor Control, Machine Vision Edge Nodes, Automotive Driver Assistance (ADAS), Medical Imaging Preprocessing, Rugged Military Communications, Smart HMI Panels.
Industrial Motor Control
The 5CSEBA4U19A7N is well-suited for industrial motor controllers because its dual ARM Cortex-A9 MPCore cores run Linux or RTOS-based supervisory loops while the 40K-logic-element Cyclone V FPGA fabric accelerates deterministic current-loop and PWM generation. The hard DDR3 controller with ECC supports 32-bit memory transactions, and the 161 user I/O pins provide flexible encoder, resolver, and gate-driver interfaces for multi-axis drives.
Inirekomenda
Machine Vision Edge Nodes
For machine vision edge nodes, the 5CSEBA4U19A7N pairs its dual 925 MHz ARM cores for image pre-processing and network connectivity with FPGA fabric acceleration for image-pipeline operations. The 224 18x18 multipliers deliver DSP bandwidth for convolution and Sobel filters, while the 3.4 Mbit embedded memory provides on-chip line buffers reducing external DDR bandwidth. Power consumption stays low thanks to the 28 nm low-power process.
Inirekomenda
Automotive Driver Assistance (ADAS)
In ADAS sensor-fusion appliances, the 5CSEBA4U19A7N automotive-grade operating range to +125C junction and its AEC-Q-style Cyclone V qualification path make it a strong host for camera and radar pre-processing. The ARM Cortex-A9 cores run perception stacks while the FPGA fabric implements low-latency object detection pipelines. Hardware SEU mitigation via ECC memory and CRC scrubbing is supported in the Quartus tool flow.
Inirekomenda
Medical Imaging Preprocessing
The 5CSEBA4U19A7N enables medical imaging subsystems to combine ARM Cortex-A9 host processing for DICOM handling and user interface with FPGA-accelerated FIR filtering and pixel-pipeline operations. The 161 user I/O accommodates Camera Link or LVDS camera interfaces, and the hard DDR3 controller manages frame-buffer memory. The 484-UBGA package supports the small form factors required for portable and cart-based equipment.
Inirekomenda
Rugged Military Communications
For ruggedized tactical radios, the 5CSEBA4U19A7N provides ARM Cortex-A9 cores for protocol stack management and the Cyclone V FPGA fabric for modem PHY and crypto-acceleration offload. The wide industrial temperature range, BGA package reliability under shock and vibration, and DDR3 controller with ECC for high-altitude radiation hardening via software scrubbing make it well-suited to defense applications.
Inirekomenda
Smart HMI Panels
Smart HMI panels benefit from the 5CSEBA4U19A7N's dual ARM Cortex-A9 cores running Linux-based GUI frameworks like Qt alongside FPGA-accelerated display refresh, touch processing, and backlight control. The 3.4 Mbit embedded memory can buffer frame layers, and the 161 user I/O interfaces easily to LVDS or RGB LCD panels, capacitive touch controllers, and industrial fieldbus peripherals in panel-mount enclosures.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for 5CSEBA4U19A7N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | 5CSEBA5U19A7N | 5CSEBA2U19A7N | 5CSEBA2U23A7N | 5CGTFD9A5U19A7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-UBGA (U19), 19x19 mm | 484-UBGA (U19), 19x19 mm - same | 484-UBGA (U19), 19x19 mm - same | 484-UBGA (U23), 23x23 mm - larger | 484-UBGA (U19), 19x19 mm - same |
| Logic Elements | 40K | 85K (+112%) | 25K (-38%) | 25K (-38%) | 300K (+650%) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same |
| Maximum HPS Clock | 925 MHz | 925 MHz - same | 925 MHz - same | 925 MHz - same | 925 MHz - same |
| Memory Controller | DDR3/DDR3L/LPDDR2 with ECC | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same | DDR3/DDR3L/LPDDR2 with ECC - same |
Pangunahing mga Pagkakaiba
- Higher DSP density than lower-tier Cyclone V SE variants (kumpara sa5CSEBA2U19A7N)
- Smaller package footprint than U23 alternatives (kumpara sa5CSEBA2U23A7N)
- Cost-optimized versus higher-density Cyclone V SE A5 (kumpara sa5CSEBA5U19A7N)
Talaan ng Disenyo
The 484-UBGA package uses a 1.0 mm ball pitch, which is at the threshold of standard 4-mil dry-film PCB manufacturing. Use laser-drilled microvias (4-6 mil capture pads, 8-10 mil drill) and HDI stack-ups with at least 1-2-1 or 2-4-2 build-up layers on the top and bottom. Escape routing on the top layer should fan-out to break-out vias on a 1.2 mm grid, with the remaining traces routed on inner signal layers.
Estimated: at typical industrial SoC FPGA utilization of 60% logic, 50% DSP, and 100% HPS at 925 MHz, the 5CSEBA4U19A7N draws approximately 4-6 W from the 1.1 V core rail. Use a 4-layer PCB with a dedicated 1.1 V plane; place 0402 0.1 uF X7R decoupling caps within 100 mil of every VCC/VCCIO ball pair, plus 10 uF bulk caps every 5-8 mm along the power plane.
The 484-UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W on a JEDEC 4-layer test board. At 5 W dissipation this yields a 60-75 C rise above ambient, which is fine for industrial applications but may require a heat spreader or forced airflow for automotive +125C junction operation. Use the Quartus PowerPlay early power estimator before committing to a cooling solution.
Do not assume that the same bitstream works across A4 and A5 family variants despite the identical U19 package footprint. The 5CSEBA4U19A7N requires a Quartus Prime compilation targeting the 40K-LE density, and migrating to A5 requires a recompile with the larger device selected. Mixing part numbers across a single production panel can cause configuration failures that are difficult to diagnose in the field.
Impormasyon ng Pagsunod sa Kautusan
RoHS and REACH compliance confirmed on Intel Cyclone V family datasheet. AEC-Q100 grade availability is part-number dependent; check -I7N / -I7SN / -A7N suffixes for industrial or automotive temperature grades. Cyclone V SoC FPGAs are manufactured on a TSMC 28 nm low-power process.
