5CSEBA4U23C7N vs 5CSEBA4U23C7SN Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U23C7N sa pamamagitan ng Intel at 5CSEBA4U23C7SN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 5CSEBA4U23C7N 5CSEBA4U23C7SN
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Device Variant 5CSEA4 (Logic Element density) —
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight Dual-core ARM Cortex-A9 MPCore with CoreSight
Logic Elements 40,000 —
HPS Maximum Core Frequency 800 MHz —
DSP Blocks (18x18) 224 112
Embedded Memory Approximately 2.7 Mbits (M10K + M9K) —
Packhaging 672-ball UBGAs (UBGA), 23x23 mm 672-ball UBGA, 23x23 mm
Core Voltage 1.1 V —
User I/O Count 364 —
High-Speed Transceivers 6 (up to 3.125 Gbps) —
PCIe Hard IP 2 Gen2 blocks —
Temperature na Operasyon Commercial 0C to +85C (C7 speed grade) -40C to +85C (industrial)
Uri ng Pagpapasok Surface Mount (BGA) —
Tindminan RoHS Compliant Compliant
Process Technology TSMC 28 nm low-power —
HPS Memory Interface DDR3, DDR3L, LPDDR2 (16-bit + ECC option) —
Device Logic Elements — 40,000
HPS Maximum Frequency — 800 MHz
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Memory (Kbits) — 2,460
Maximum User I/Os — 364
Ball Pitch — 0.8 mm
Process Node — TSMC 28 nm low-power
Memory Interfaces — DDR2, DDR3, LPDDR2 (hard controller)
Peripherals (HPS) — USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART
Configuration Modes — JTAG, serial passive/active
Speed Grade — C7

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