5CSEBA4U23C8N vs 5CSEBA4U23C7SN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U23C8N sa pamamagitan ng Intel at 5CSEBA4U23C7SN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C8N ✓ NakahandaIntel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA4U23C8N | 5CSEBA4U23C7SN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements (LE) | 40,000 | — |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum HPS Frequency | 600 MHz | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP count] | — |
| Multipliers | 18x18 dedicated multipliers | — |
| Maximum User I/O | 188 | — |
| Packhaging | 672-pin UBGA (UBGA-672, 23x23 mm) | 672-ball UBGA, 23x23 mm |
| Process Technology | TSMC 28 nm low-power | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC | — |
| Memory Controller (HPS) | DDR3/DDR3L/LPDDR2 with hard PHY | — |
| Temperature na Operasyon | [DATA_NEEDED: industrial Tj range] | -40C to +85C (industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 40,000 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 800 MHz |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Kbits) | — | 2,460 |
| DSP Blocks (18x18) | — | 112 |
| Maximum User I/Os | — | 364 |
| Ball Pitch | — | 0.8 mm |
| Process Node | — | TSMC 28 nm low-power |
| Memory Interfaces | — | DDR2, DDR3, LPDDR2 (hard controller) |
| Peripherals (HPS) | — | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART |
| Configuration Modes | — | JTAG, serial passive/active |
| Speed Grade | — | C7 |