A3P1000-1FGG144T vs A3P600-2FGG144 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P1000-1FGG144T sa pamamagitan ng Microchip Technology at A3P600-2FGG144 sa pamamagitan ng Microsemi. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip
A3P1000-1FGG144T ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | A3P1000-1FGG144T | A3P600-2FGG144 |
|---|---|---|
| Brand | Microchip Technology | Microsemi |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| Number of Logic Elements | 11K LEs | — |
| Number of Gates | 1000000 | — |
| Total RAM Bits | 147456 | — |
| Number of I/O | 97 | — |
| Volte ng Pagbibigay | 1.425V to 1.575V | — |
| Temperature na Operasyon | -40°C to +125°C | [DATA_NEEDED: operating temperature range] |
| Packhaging / Kaso | 144-LBGA | — |
| Supplier Device Package | 144-FPBGA (13x13) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Grade | Automotive | — |
| Differential I/O Standards | LVPECL, LVDS, B-LVDS, M-LVDS | — |
| Number of CCC Blocks | 6 | — |
| Number of PLLs | 1 | — |
| Packaging | Tray | Tray |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| System Performance | — | 310 MHz |
| Process Technology | — | 130 nm CMOS |
| Core Voltage | — | 1.5 V |
| Program Technology | — | Nonvolatile Flash |
| Packhaging | — | 144-Ball FBGA (FGG144) |
| Ball Pitch | — | 1 mm |
| Speed Grade | — | -2 |
| Configuration | — | Single-chip, Instant On, no external boot device |
| I/O Banks | — | 4 (independently supplied VCCIB banks) |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |