A3PE3000L-1FGG484I vs A3PE3000L-1FGG484M Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG484I sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG484M sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
A3PE3000L-1FGG484M ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG484I | A3PE3000L-1FGG484M |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Volte ng Pagbibigay | 1.14 V to 1.575 V | — |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Packhaging / Kaso | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (TJ) | [DATA_NEEDED: operating temperature range for -M suffix] |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | — |
| Tindminan RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 3000000 |
| Logic Elements | — | 35K LEs |
| CLBs | — | 75264 |
| User I/Os | — | 341 |
| Embedded SRAM | — | 516096 bits (504 kbits) true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage (VCCI) | — | as low as 1.2 V |
| Process Technology | — | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration | — | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable |
| Special Features | — | Flash*Freeze technology |
| Packhaging | — | 484-ball FBGA (FGG484), 1 mm pitch |
| Design Software | — | Microchip Libero SoC |