A3PE3000L-FG484 vs A3PE3000L-FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG484 sa pamamagitan ng Microchip Technology at A3PE3000L-FG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ NakahandaMicrochip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG484 | A3PE3000L-FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 | 3000000 (3.00E6) |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | Nonvolatile flash, Live-at-Power-Up Level 0 |
| Low Power Feature | Flash*Freeze technology | — |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature] | -40C to +100C (TJ, industrial) |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | ROHS3 Compliant |
| Logic Cells (DFFs) | — | 75264 |
| User I/O (this package) | — | 341 |
| Max User I/O (family) | — | 616 |
| Embedded SRAM | — | 504 kbit true dual-port |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | — | 1.14 V to 1.575 V (1.2 V typical) |
| Single-Chip Solution | — | Yes (no external configuration PROM) |
| Packhaging | — | 484-ball FBGA (23x23 mm, 1 mm pitch) |
| Speed | — | [DATA_NEEDED: speed grade / max frequency] |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |
| Logic Family | — | CMOS |