A3PE3000L-FG896 vs A3PE3000L-1FGG896 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG896 sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG896 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
A3PE3000L-FG896 ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FG896 | A3PE3000L-1FGG896 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| User I/O | 620 | 620 |
| Logic Cells | 75,264 | 75264 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Technology | 130 nm nonvolatile flash | — |
| Configuration Memory | Nonvolatile flash (single-chip, Instant On) | Nonvolatile flash (single-chip) |
| Packhaging | 896-ball FBGA | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Low Power Feature | Flash*Freeze technology | — |
| Max Operating Frequency | [DATA_NEEDED: max operating frequency] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory size] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Operating Temperature Suffix | Commercial (unmarked suffix; -I grade is industrial) | — |
| Tindminan RoHS | unknown | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Programmability | In-system reprogrammable | — |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Speed Grade | — | -1 |
| Process Technology | — | 130 nm flash |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |