A3PE3000L-FGG896I vs A3PE3000L-1FGG896I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FGG896I sa pamamagitan ng Microchip Technology at A3PE3000L-1FGG896I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ NakahandaMicrochip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FGG896I | A3PE3000L-1FGG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 | 3000000 |
| Total RAM Bits | 516096 bits | — |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) | — |
| Number of I/O | 620 | — |
| Volte ng Pagbibigay | 1.14 V to 1.575 V | — |
| Core Voltage Support | 1.2 V to 1.5 V | — |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based | — |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 | Nonvolatile flash, single-chip, Instant On |
| Special Features | Flash*Freeze technology, single-chip solution | — |
| Packhaging / Kaso | 896-BGA (FBGA, 1 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount |
| Temperature na Operasyon | Industrial grade (I suffix) | -40C to +85C (industrial, I suffix) |
| Packaging | Tray, standard quantity 27 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | Standard (no speed suffix) | -1 |
| User I/O | — | 620 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Packhaging | — | 896-ball FBGA, 1 mm pitch |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| PLLs | — | 6 |
| Maximum System Performance | — | Approx. 272 MHz |
| Low Power Feature | — | Flash*Freeze Technology |
| Logic Family | — | CMOS |
| Power-Up Support | — | Live at Power-Up Level 0 |