ADTF3175 vs ADTF3175D-NXZ Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng ADTF3175 sa pamamagitan ng Analog Devices at ADTF3175D-NXZ sa pamamagitan ng Analog Devices. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Analog Devices
ADTF3175 ADTF3175 - 1MP iToF 3D Depth Module | Analog Devices

ADTF3175 - 1MP iToF 3D Depth Module | Analog Devices

ADTF3175 ✓ Nakahanda
Analog Devices
ADTF3175D-NXZ ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices

ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices

ADTF3175D-NXZ ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro ADTF3175 ADTF3175D-NXZ
Brand Analog Devices Analog Devices
Kategorya Image Sensors Image Sensors
Katayuan ng Lifecycle Aktibo Aktibo
Product Type Time-of-Flight (ToF) module Time-of-Flight (ToF) Evaluation Kit
Imager ADSD3100 CMOS indirect ToF (iToF) ADSD3100 (CMOS indirect ToF)
Pangangasiwaan 1024 H x 1024 V (1 megapixel) 1 megapixel (1024 x 1024)
Pixel Size 3.5 µm x 3.5 µm —
Output Interface MIPI CSI-2 Tx (4-lane) —
Integrated Components Lens, optical band-pass filter, IR illuminator, power regulators —
Module Form Factor 75 mm x 75 mm open frame —
Calibration Factory calibrated, multi-range + multi-resolution modes —
Packaging Type Open-frame module (Distance Sensor Module) —
Uri ng Pagpapasok Board mount (open frame) Bench / lab evaluation board
Orderable Part Number ADTF3175BMLZ —
Katayuan ng Lifecycle Recommended for new designs —
Matching Evaluation Kit EVAL-ADTF3175D-NXZ (with ADSD3500 depth ISP) —
Tindminan RoHS Compliant [DATA_NEEDED: rohs status]
Manufacturer Analog Devices Inc. —
Main Module — ADTF3175
Depth ISP — ADSD3500
ToF Technique — Indirect ToF (iToF), continuous-wave modulation
Integrated Optics — Lens, optical band-pass filter, IR illumination optics
Illumination Source — Laser diode with integrated driver and photodetector
Host Interface — Ethernet over USB
Host Software — Windows host GUI + open-source multi-platform SDK
Operating System Support — Windows host; ROS / ROS 2 via adi_3dtof_image_stitching package
Fungsi — 3D depth sensing and vision system evaluation
Form Factor — Complete EVK (PCB + module + cabling)

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