AFS600-1FG256K vs M7AFS600-FGG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-1FG256K sa pamamagitan ng Microchip Technology at M7AFS600-FGG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ NakahandaMicrochip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-1FG256K | M7AFS600-FGG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | — |
| Programmable Logic | Flash-based programmable logic | — |
| Equivalent System Gates | 600,000 gates | — |
| Logic Cells | 13,824 logic cells | — |
| User I/O | 119 I/O | 119 |
| Maximum Frequency | 1282.05 MHz | 1098.9 MHz (distributor listing) |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Integrated Analog | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Packhaging | 256-terminal plastic ball grid array (256-LBGA) | 256-LBGA / 256-FBGA |
| Terminal Count | 256 terminals | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.00 mm | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Uri ng Pagpapasok | Surface mount | Surface Mount |
| Ordering Package Option | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Family | — | Fusion (M7AFS600) |
| System Gates | — | 600K |
| Flip-Flops | — | 110592 |
| Embedded Processor | — | ARM CoreMP7 |
| Process Technology | — | 130 nm flash-based |
| Ball Pitch | — | 1 mm |
| Configuration Memory | — | Flash (single-chip, non-volatile) |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Temperature na Operasyon | — | [DATA_NEEDED: Operating Temperature Range] |
| Packaging | — | Tray |
| Level ng MSL | — | [DATA_NEEDED: Moisture Sensitivity Level] |