ATSAMA5D23B-CN vs ATSAMA5D225C-D1M-CU Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D23B-CN sa pamamagitan ng Microchip Technology at ATSAMA5D225C-D1M-CU sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D23B-CN - 500MHz ARM Cortex-A5 MPU 128KB SRAM | Microchip
ATSAMA5D23B-CN ✓ NakahandaMicrochip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D23B-CN | ATSAMA5D225C-D1M-CU |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | ARM Cortex-A5 (Armv7-A) | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Maximum Clock Speed | 500 MHz | — |
| L1 Instruction Cache | 32 kbyte | — |
| L1 Data Cache | 32 kbyte | — |
| L2 Cache | 128 kbyte (configurable as internal SRAM) | — |
| NEON Media Engine | Yes | — |
| ARM TrustZone | Yes | — |
| MMU | Yes | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Packhaging | 196-TFBGA (11x11 mm) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| Ball Pitch | 0.8 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Backup Mode Current | 5 uA typical | — |
| Width ng Data Bus | 32-bit | — |
| Series | SAMA5D2 | — |
| Tindminan RoHS | Compliant | Compliant (Green, lead-free) |
| Core Processor | — | ARM Cortex-A5 |
| Maximum CPU Clock | — | 500 MHz |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| Graphics Acceleration | — | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Ethernet | — | 10/100/1000 GMAC |
| USB | — | 1x HSIC, 1x USB 2.0 HS Host/Device |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | — | Peripheral Touch Controller (PTC) integrated |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| Temperature na Operasyon | — | -40C to +85C (Industrial, IND TEMP) |
| Volte ng Pagbibigay | — | 1.2 V core (per typical SiP) |