BSC9132NSN7MNMB vs BSC9132NSE7MNMB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng BSC9132NSN7MNMB sa pamamagitan ng NXP Semiconductors at BSC9132NSE7MNMB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
BSC9132NSN7MNMB - QorIQ Qonverge SoC 2x1.2GHz StarCore/e500 | NXP
BSC9132NSN7MNMB NrndNXP Semiconductors
BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP
BSC9132NSE7MNMB ✓ NakahandaPagsanggunian na paghahambing
| Parametro | BSC9132NSN7MNMB | BSC9132NSE7MNMB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Architecture | QorIQ Qonverge SoC | QorIQ Qonverge BSC |
| CPU Cores | 2 x Power Architecture e500 (32-bit) up to 1.333 GHz | 2x PowerPC e500, 1.2 GHz |
| DSP Cores | 2 x StarCore SC3850 up to 1.2 GHz | 2x StarCore SC3850, 1.2 GHz |
| Hardware Accelerator | MAPLE-B2P (LTE baseband) | — |
| Physical Addressing | 36-bit | — |
| Memory Controller | DDR3 / DDR3L with ECC support | — |
| Ethernet | Multiple 10/100/1000 MAC interfaces | — |
| High-Speed Serial | PCI Express, RapidIO, SerDes | — |
| Temperature na Operasyon | 0 °C to +105 °C | 0C to +105C |
| Packhaging | 780-FCBGA (23 mm x 23 mm) | 780-pin FCBGA (23x23 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | 3 (per Partstack listing) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per DigiKey) |
| Volte ng Pagbibigay | [DATA_NEEDED: core/rail voltage levels] | — |
| Product Type | — | Multicore Baseband SoC (MPU + DSP) |
| Max Core Frequency | — | 1.333 GHz |
| Baseband Accelerator | — | MAPLE-B2P (Turbo + Viterbi + FEC) |
| Security Engine | — | SEC (Integrated) |
| Process Technology | — | 45 nm CMOS |
| Peak Reflow Temperature | — | 245C (per Partstack listing) |
| Lead-Free / Solder Finish | — | e1 (per Partstack listing) |
| Width ng Data Bus | — | 32-bit |