EP1AGX50CF484C3 vs EP1AGX35CF484C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1AGX50CF484C3 sa pamamagitan ng Intel at EP1AGX35CF484C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1AGX50CF484C3 | EP1AGX35CF484C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Arria GX | Arria GX |
| Logic Elements | 50,160 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total RAM Bits | 2,475,072 bits | — |
| M4K Memory Blocks | 4,506 | — |
| M-RAM Blocks | 252 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Channels | 12 (up to 3.125 Gbps) | — |
| User I/O Pins | 232 | 230 |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-pin FC-FBGA (Flip-Chip BGA) |
| Speed Grade | C3 (commercial, fastest) | C6 (commercial) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V | — |
| Configuration Method | Passive serial, Fast passive parallel, JTAG | — |
| Tindminan RoHS | Compliant | — |
| Process Technology | 90 nm | 90 nm |
| Logic Elements (LE) | — | 33,520 |
| Embedded Memory | — | 1,348,416 bits |
| Core Supply Voltage | — | 1.2 V |
| Transceivers | — | 4 channels, 600 Mbps to 3.125 Gbps |
| DSP Blocks | — | 18x18 multipliers |
| Memory Blocks | — | M9K and M-RAM |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Uri ng Pagpapasok | — | Surface Mount |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |