EP1C12F324C8L vs EP1C12F324C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C12F324C8L sa pamamagitan ng Intel at EP1C12F324C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C12F324C8L | EP1C12F324C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Cyclone | Cyclone |
| Logic Elements | 12,060 | — |
| Embedded RAM Bits | 239,616 | — |
| M4K RAM Blocks | 52 | — |
| User I/O Pins | 249 | — |
| PLLs | 2 | — |
| Packhaging | FBGA-324 | 324-ball FineLine BGA (FBGA-324) |
| Package Body Size | 19 x 19 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 8 | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | CMOS, 130 nm | 130 nm CMOS |
| Temperature na Operasyon | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Power Variant | Low-power (L suffix) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Number of CLBs / LABs | — | 1,206 LABs (each with 10 LEs) |
| Number of Logic Cells / Gates | — | 12,060 cells (Cyclone Family) |
| User I/Os | — | 249 |
| Core Voltage | — | 1.5 V |
| Operating Frequency (max) | — | 320.1 MHz |
| Number of PLLs | — | 2 |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm pitch |
| Configuration Mode | — | Passive Serial (PS) / Active Serial (AS) / JTAG |