EP1C4F324C7N vs EP1C3T144C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C4F324C7N sa pamamagitan ng Intel at EP1C3T144C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C4F324C7N | EP1C3T144C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Device Family | Cyclone | — |
| Logic Elements | 4000 | — |
| Logic Array Blocks / CLBs | 249 LABs | — |
| Total RAM Bits | 78336 bits (~9.6 KB) | — |
| Maximum User I/Os | 249 | — |
| PLLs | 2 | 1 |
| Package Type | FBGA-324 (FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 0.13 um SRAM-based CMOS | 130 nm |
| Speed Grade | C7 (commercial, mid-speed) | 7 |
| Internal Frequency (max) | 405 MHz | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Series | — | Cyclone® |
| Family | — | Cyclone I |
| Logic Elements (LEs) | — | 2,910 |
| Embedded RAM Bits | — | 59,904 |
| Logic Array Blocks (LABs) | — | 291 |
| User I/Os | — | 104 |
| Core Voltage | — | 1.5 V |
| Packhaging | — | 144-LQFP (T144) |
| Lead Pitch | — | 1.0 mm |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |