EP20K100CF324C7 vs EP20K100CF144C9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100CF324C7 sa pamamagitan ng Intel at EP20K100CF144C9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100CF324C7 | EP20K100CF144C9 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10K | APEX-20K |
| Series | EP20K100 | — |
| Logic Elements (LEs) | 4,160 | — |
| System Gates | 100,000 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum RAM Bits | 49,152 | — |
| Maximum User I/O | 246 | — |
| Packhaging | 324-FBGA (FineLine BGA) | 144-LQFP |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Temperature na Operasyon | 0 °C to +70 °C (commercial) | — |
| Speed Grade | C7 (slowest commercial bin) | C9 (commercial) |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG | SRAM / JTAG (IEEE 1149.1) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | unknown | — |
| Device Logic Elements | — | 4,160 |
| Typical Gates | — | 100,000 |
| Embedded System Blocks (ESBs) | — | 4 |
| Maximum User I/O Pins | — | 93 |
| Embedded RAM Bits | — | 53,248 |
| Pin Pitch | — | 0.5 mm [DATA_NEEDED: confirm pitch, datasheet quotes 0.5 mm for LQFP-144] |
| Core Voltage | — | 2.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+ [DATA_NEEDED: full list per datasheet I/O chapter] |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Lead-Free / RoHS | — | [DATA_NEEDED: not stated in distributor snippets] |