EP20K100CF324C7 vs EP20K100CF324C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100CF324C7 sa pamamagitan ng Intel at EP20K100CF324C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100CF324C7 | EP20K100CF324C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10K | APEX-20K |
| Series | EP20K100 | — |
| Logic Elements (LEs) | 4,160 | — |
| System Gates | 100,000 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum RAM Bits | 49,152 | — |
| Maximum User I/O | 246 | 246 |
| Packhaging | 324-FBGA (FineLine BGA) | 324-FBGA (FineLine BGA) |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Temperature na Operasyon | 0 °C to +70 °C (commercial) | 0°C to +85°C (commercial) |
| Speed Grade | C7 (slowest commercial bin) | C8 (commercial, 8 ns) |
| Process Technology | 0.22 µm CMOS SRAM | 0.18 µm CMOS |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 4,160 |
| Typical Gates | — | 100,000 |
| Embedded RAM Bits | — | 53,248 |
| Embedded System Blocks (ESBs) | — | 26 |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.8 V typical |
| Configuration Interface | — | JTAG (IEEE 1149.1), serial/parallel |
| I/O Standards | — | LVCMOS, LVTTL, SSTL, HSTL |
| Design Software | — | Quartus II (legacy) |