EP20K100FC324-3 vs EP20K100FC324-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100FC324-3 sa pamamagitan ng Intel at EP20K100FC324-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100FC324-3 | EP20K100FC324-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | APEX 20K | — |
| Family | APEX 20K (non-KE) | — |
| System Gates | 100,000 | — |
| Logic Elements | 4,160 | — |
| Maximum Logic Blocks | 26 | — |
| Embedded Memory (RAM bits) | 53,248 | — |
| User I/O Pins | 252 | — |
| Total RAM bits | 53,248 | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 167 MHz | — |
| Propagation Delay | 1.6 ns | — |
| Speed Grade | -3 (slowest) | — |
| Packhaging | 324-pin FBGA (Fine-pitch BGA) | 324-ball FBGA |
| Package Body Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Temperature na Operasyon | 0 °C to 85 °C (Commercial) | 0°C to 85°C |
| Programming Interface | IEEE 1149.1 JTAG | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Family | — | APEX 20K |
| Equivalent Gates | — | 100,000 |
| Logic Cells | — | 4,160 |
| Maximum User I/Os | — | 252 |
| Bilang ng Pin | — | 324 |
| Technology Node | — | 0.22 µm CMOS |
| Propagation Delay (tPD) | — | 1.6 ns |
| Internal Performance | — | 200 MHz |
| Configuration Method | — | JTAG / serial configuration PROM |
| Embedded Memory | — | Dual-port RAM blocks (ESB) |
| Programming Toolchain | — | Altera Quartus / MAX+PLUS II |