EP20K200CB356C7ES vs EP20K200CB356C8ES Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K200CB356C7ES sa pamamagitan ng Intel at EP20K200CB356C8ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K200CB356C7ES | EP20K200CB356C8ES |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | APEX 20KC | APEX 20KC MultiCore Interconnect FPGA |
| System Gates | 200,000 | 200,000 |
| Logic Elements / Cells | 8,320 | 8,320 |
| Maximum User I/O | 271 | — |
| Packhaging | 356-Ball BGA (CB) | — |
| Core Voltage | 1.8 V | 1.8 V |
| Operating Frequency (max) | 375.94 MHz | 301.21 MHz |
| Process Technology | 0.15 µm CMOS | 0.15 µm |
| Embedded Memory Blocks | Yes (ESB - True Dual-Port / CAM) | — |
| PLLs | 4 | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0°C to +70°C) | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: rohs status] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | APEX 20KC |
| User I/O Count | — | 271 |
| Package Type | — | 356-LBGA (Ball Grid Array) |
| Temperature na Operasyon | — | 0°C to +85°C (Commercial) |
| Speed Grade | — | C8 (8 ns) |
| Uri ng Memory | — | SRAM-based, Embedded System Blocks (ESBs) |
| Programming Interface | — | JTAG / ByteBlaster / USB-Blaster |
| Design Software | — | Quartus II / MAX+PLUS II |
| Embedded Memory | — | Yes (ESBs) |