EP20K300EFC672-2 vs EP20K300EFI672-2X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K300EFC672-2 sa pamamagitan ng Intel at EP20K300EFI672-2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K300EFC672-2 | EP20K300EFI672-2X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | APEX 20KE | APEX 20KE |
| Series | APEX 20K | — |
| System Gates | 300,000 | 300,000 |
| Logic Elements | 11,520 | — |
| Embedded Memory (ESB) | 147,456 bits | — |
| Maximum User I/O | 408 | — |
| Maximum Internal Frequency | 350 MHz | 350 MHz |
| Propagation Delay (pin-to-pin) | 1.68 ns | — |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 µm | — |
| Core Supply Voltage | 1.8 V | 1.8 V |
| Packhaging | 672-pin FineLine BGA (FBGA) | 672-ball FineLine BGA (FBGA) |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | -40 °C to +85 °C (industrial) |
| Configuration Interface | Passive Serial / EPC / JTAG (IEEE 1149.1) | — |
| Programming Tool | Quartus II / MAX+PLUS II | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Elements (Cells) | — | 11,520 |
| Embedded Memory | — | 147,456 bits |
| User I/Os | — | 408 |
| Propagation Delay | — | 1.68 ns |
| Process Technology | — | 0.22 µm CMOS |
| Package Pin Count | — | 672 |
| Speed Grade | — | -2X (enhanced) |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |