EP20K400FI784-2 vs EP20K400FI784-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400FI784-2 sa pamamagitan ng Altera at EP20K400FI784-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K400FI784-2 | EP20K400FI784-3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Device Family | APEX 20K | — |
| Typical Gates | 400,000 | — |
| Logic Elements (LEs) | [DATA_NEEDED: logic elements count] | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | [DATA_NEEDED: ESB count] |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count] | — |
| Dedicated Inputs | 4 | 4 |
| Nominal Core Supply Voltage (VCCINT) | 2.5 V | — |
| VCCINT Range | 2.375 V to 2.625 V | — |
| Speed Grade | -2 | -3 (slowest) |
| Hanay ng Temperature na Operasyon | -40 °C to +100 °C | — |
| Package Type | S-PBGA-B784 (FineLine BGA) | — |
| Package Pin Count | 784 balls | — |
| Ball Pitch | 1.000 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | 3 |
| Device Form Factor | Loadable PLD | — |
| Process Technology | [DATA_NEEDED: process node] | 0.18 µm CMOS SRAM |
| Configuration Memory | SRAM-based (volatile) | — |
| Family | — | APEX 20K |
| Typical Gate Count | — | 400,000 gates |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Supply Voltage (Nominal) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Temperature na Operasyon | — | -40 °C to +100 °C (industrial) |
| Packhaging | — | 784-ball PBGA (Fine-pitch BGA) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.000 mm |
| Seated Height (max) | — | 2.7000 mm |
| Body Material | — | Plastic / Epoxy |
| Configuration Method | — | SRAM (external EPROM required) |