EP20K400FI784-3 vs EP20K400FI784-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400FI784-3 sa pamamagitan ng Intel at EP20K400FI784-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K400FI784-3 | EP20K400FI784-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX 20K | — |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Dedicated Inputs | 4 | 4 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | [DATA_NEEDED: ESB count] |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | -2 |
| Temperature na Operasyon | -40 °C to +100 °C (industrial) | — |
| Packhaging | 784-ball PBGA (Fine-pitch BGA) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| Level ng MSL | 3 | [DATA_NEEDED: MSL rating] |
| Configuration Method | SRAM (external EPROM required) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm CMOS SRAM | [DATA_NEEDED: process node] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | APEX 20K |
| Typical Gates | — | 400,000 |
| Logic Elements (LEs) | — | [DATA_NEEDED: logic elements count] |
| Maximum User I/O Pins | — | [DATA_NEEDED: user I/O count] |
| Nominal Core Supply Voltage (VCCINT) | — | 2.5 V |
| VCCINT Range | — | 2.375 V to 2.625 V |
| Hanay ng Temperature na Operasyon | — | -40 °C to +100 °C |
| Package Type | — | S-PBGA-B784 (FineLine BGA) |
| Package Pin Count | — | 784 balls |
| Ball Pitch | — | 1.000 mm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Device Form Factor | — | Loadable PLD |
| Configuration Memory | — | SRAM-based (volatile) |