EP20K400FI784-3 vs EP20K400FI784-2 比較

詳細並排比較 EP20K400FI784-3 由 Intel 與 EP20K400FI784-2 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP20K400FI784-3 EP20K400FI784-2
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Family APEX 20K —
Typical Gate Count 400,000 gates —
Logic Elements [DATA_NEEDED: exact LE count] —
Dedicated Inputs 4 4
Embedded System Blocks (ESBs) [DATA_NEEDED: ESB count] [DATA_NEEDED: ESB count]
Maximum User I/O [DATA_NEEDED: user I/O count] —
Supply Voltage (Nominal) 2.5 V —
Supply Voltage Range 2.375 V to 2.625 V —
Speed Grade -3 (slowest) -2
工作溫度 -40 °C to +100 °C (industrial) —
封裝 784-ball PBGA (Fine-pitch BGA) —
Package Code BGA —
Package Shape Square —
Terminal Pitch 1.000 mm —
Seated Height (max) 2.7000 mm —
Body Material Plastic / Epoxy —
MSL 等級 3 [DATA_NEEDED: MSL rating]
Configuration Method SRAM (external EPROM required) —
安裝類型 Surface Mount Surface Mount
Process Technology 0.18 µm CMOS SRAM [DATA_NEEDED: process node]
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
Device Family — APEX 20K
Typical Gates — 400,000
Logic Elements (LEs) — [DATA_NEEDED: logic elements count]
Maximum User I/O Pins — [DATA_NEEDED: user I/O count]
Nominal Core Supply Voltage (VCCINT) — 2.5 V
VCCINT Range — 2.375 V to 2.625 V
工作溫度範圍 — -40 °C to +100 °C
Package Type — S-PBGA-B784 (FineLine BGA)
Package Pin Count — 784 balls
Ball Pitch — 1.000 mm
Lead-Free — [DATA_NEEDED: lead-free status]
Device Form Factor — Loadable PLD
Configuration Memory — SRAM-based (volatile)

資料表與資源

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