EP20K600CF672C8N vs EP20K600CF672 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K600CF672C8N sa pamamagitan ng Intel at EP20K600CF672 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Pagsanggunian na paghahambing
| Parametro | EP20K600CF672C8N | EP20K600CF672 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | [DATA NEEDED: Lifecycle Status] |
| Device Type | SPLD | — |
| Product Type | FPGA / programmable logic device | Field-Programmable Gate Array (FPGA) |
| Family | APEX 20KC | — |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| Packhaging | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| Volte ng Pagbibigay | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Fabrication Process | 0.15 µm | — |
| Temperature na Operasyon | 0°C to 85°C | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Uri ng Pagpapasok | Surface mount | Surface Mount |
| Tindminan RoHS | unknown | unknown |
| REACH Status | unknown | unknown |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Thermal Resistance | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Device Type Listed by Supplied References | — | SPLD |
| Process Technology | — | 0.15 um all-layer copper-metal process for supplied family references |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| AEC-Q100 Status | — | unknown |