EP20K600CF672C8N vs EP20K600CF672 موازنہ
تفصیلی ساتھ ساتھ موازنہ از EP20K600CF672C8N بذریعہ Intel اور EP20K600CF672 بذریعہ Intel. اہم خصوصیات، برقی پیرامیٹرز، پیکیجنگ، لائف سائیکل اسٹیٹس، قیمتوں اور دستیابی کا موازنہ کریں تاکہ آپ کی ڈیزائن ضروریات کے لیے بہترین کمپوننٹ کا تعین ہو سکے۔
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]خصوصیات کا موازنہ
| پیرامیٹر | EP20K600CF672C8N | EP20K600CF672 |
|---|---|---|
| برانڈ | Intel | Intel |
| زمرہ | FPGA & CPLD | FPGA & CPLD |
| لائف سائیکل کی حالت | فعال | [DATA NEEDED: Lifecycle Status] |
| Device Type | SPLD | — |
| Product Type | FPGA / programmable logic device | Field-Programmable Gate Array (FPGA) |
| Family | APEX 20KC | — |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| پیکیج | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| سپلائی وولٹیج | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Fabrication Process | 0.15 µm | — |
| آپریٹنگ درجہ حرارت | 0°C to 85°C | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| ماؤنٹنگ ٹائپ | Surface mount | Surface Mount |
| RoHS اسٹیٹس | unknown | unknown |
| REACH Status | unknown | unknown |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| تھرمل ریزسٹنس | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Device Type Listed by Supplied References | — | SPLD |
| Process Technology | — | 0.15 um all-layer copper-metal process for supplied family references |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| AEC-Q100 Status | — | unknown |