EP2A15B724C9 vs EP2A15B724C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A15B724C9 sa pamamagitan ng Intel at EP2A15B724C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A15B724C9 | EP2A15B724C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | 16,640 |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper, up to 8 metal layers |
| Maximum Internal Frequency | 500 MHz | 435 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| Packhaging | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 724-pin FCBGA (flip-chip BGA) |
| Temperature na Operasyon | Commercial (0 °C to +85 °C) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Manufacturer | — | Intel (formerly Altera) |
| System Gates | — | 600,000 |
| Embedded RAM Bits | — | 425,984 |
| User I/O | — | 492 |
| Pin-to-Pin Logic Delay (tPD) | — | 1.94 ns |
| Core Voltage | — | 1.5 V |
| High-Speed Serial Support | — | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| PLLs | — | 4 |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature grade] |