EP2A25F1020C8ES vs EP2A15F672C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F1020C8ES sa pamamagitan ng Intel at EP2A15F672C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F1020C8ES | EP2A15F672C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | APEX II | APEX II FPGA |
| Logic Elements | 24,320 | — |
| System Gates | 2,750,000 | — |
| Embedded Memory (bits) | 622,592 | — |
| Maximum User I/O | 735 | 492 |
| Packhaging | 1020-ball FineLine BGA | 672-ball FineLine BGA (FCBGA) |
| Package Code Suffix | F1020 | — |
| Speed Grade | 8 | C7 |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Suffix Code | ES (Engineering Sample) | — |
| Core Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal] | — |
| Process Technology | [DATA_NEEDED: process node] | 0.15 µm all-layer copper, up to 8 metal layers |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II (EP2A15) |
| Logic Elements (LE) | — | 16,640 |
| Total System Gates | — | 425,984 |
| Embedded Memory Bits | — | 425,984 |
| Number of Macrocells / Logic Units | — | 16,640 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Core Voltage | — | 1.5 V |
| High-Speed I/O Standard | — | True-LVDS, LVPECL, PCML, HyperTransport |
| True-LVDS Data Rate | — | 1 Gbps |
| Package Dimensions | — | 27 mm × 27 mm, 1.0 mm pitch |
| Temperature na Operasyon | — | Commercial (0°C to +85°C) |